参数资料
| 型号： | IR3080M |
| 厂商： | International Rectifier |
| 文件页数： | 38/41页 |
| 文件大小： | 0K |
| 描述： | IC PHASE CONTROLLER 32-MLPQ |
| 标准包装： | 5 |
| 系列： | XPhase™ |
| 应用： | 处理器 |
| 电流 - 电源： | 11mA |
| 电源电压： | 9.5 V ~ 14 V |
| 工作温度： | 0°C ~ 100°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-MLPQ（5x5） |
| 包装： | 剪切带 (CT) |
| 其它名称： | *IR3080M |
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IR3080
Solder Resist
? The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
? The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is
completely removed from between the lead lands forming a single opening for each “group” of lead
lands.
? At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
fillet so a solder resist width of ≥ 0.17mm remains.
? The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
? Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
aspect ratio of the solder resist strip separating the lead lands from the pad land.
? The single via in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than
the diameter of the via.
Page 38 of 41
9/30/04
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PDF描述 |
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| IR3081AMPBF | IC CTRLR XPHASE VR10.0 28MLPQ |
| IR3081AMTRPBF | IC CTRLR XPHASE VR10.0 28MLPQ |
| IR3081MPBF | IC PHASE CONTROLLER 28MLPQ |
| IR3081M | IC PHASE CONTROLLER 28-MLPQ |
| IR3082AMTRPBF | IC XPHASE CONTROL 9.6V 20-MLPQ |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IR3080MPBF | 功能描述:IC PHASE CONTROLLER 32MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| IR3080MPBF | 制造商:International Rectifier 功能描述:Controller IC Package/Case:32-MLPQ |
| IR3080MTR | 功能描述:IC PHASE CONTROLLER 32L MLPQ RoHS:否 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| IR3080MTRPBF | 功能描述:开关变换器、稳压器与控制器 XPHASE VRD10 CTRL IC CTRL IC 200 to 700mV RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| IR3080PBF | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASETM VRD10 CONTROL IC WITH VCCVID & OVERTEMP DETECT |
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