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参数资料
| 型号： | IR533C |
| 厂商： | Everlight Electronics Co Ltd |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | LED IR SMD GAA1AS WATER CLEAR |
| 标准包装： | 500 |
| 电流 - DC 正向(If)： | 100mA |
| 辐射强度(le)最小值@正向电流： | * |
| 波长： | 940nm |
| 正向电压： | 1.2V |
| 视角： | 25° |
| 方向： | 顶视图 |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 包装： | 散装 |
| 其它名称： | 1080-1084 |
DATASHEET
5.0mm Infrared LED
IR533C
Notes
1.
Lead Forming
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During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it
may break the LEDs.
Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs
are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2.
Storage
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The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits
are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a
nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can
occur.
3.
Soldering
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Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,
and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
Hand Soldering
DIP Soldering
Temp. at tip of iron
Soldering time
Distance
300 ℃ Max. (30W Max.)
3 sec Max.
3mm Min.(From solder
joint to epoxy bulb)
Preheat temp.
Bath temp. & time
Distance
100 ℃ Max. (60 sec Max.)
260 Max., 5 sec Max
3mm Min. (From solder
joint to epoxy bulb)
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Recommended soldering profile
laminar wave
Fluxing
Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to
room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
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www.everlight.com
:2
Revision Copyright ?
LifecyclePhase:
No: Release
2010, Everlight All Rights Reserved. Release Date :MAY.27.2013. Issue DIR-0000943 Date:2013-05-29 15:53:03.0
Expired Period: Forever
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IR53H214 | 制造商:未知厂家 制造商全称:未知厂家 功能描述: |
| IR53H420 | 制造商:International Rectifier 功能描述: |
| IR53H420-P2 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SELF-OSCILLATING HALF BRIDGE(82.40 k) |
| IR53HD420 | 功能描述:IC HALF BRIDGE SELF-OSC 9-SIP RoHS:否 类别:集成电路 (IC) >> PMIC - MOSFET，电桥驱动器 - 内部开关 系列:- 标准包装:1,000 系列:- 类型:高端/低端驱动器 输入类型:SPI 输出数:8 导通状态电阻:850 毫欧，1.6 欧姆 电流 - 输出 / 通道:205mA，410mA 电流 - 峰值输出:500mA，1A 电源电压:9 V ~ 16 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:20-SOIC（0.295"，7.50mm 宽） 供应商设备封装:PG-DSO-20-45 包装:带卷 (TR) |
| IR53HD420-P2 | 制造商:IRF 制造商全称:International Rectifier 功能描述:SELF-OSCILLATING HALF BRIDGE |
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