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参数资料
| 型号： | IRDC3856 |
| 厂商： | International Rectifier |
| 文件页数： | 33/35页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR IR3856 |
| 标准包装： | 1 |
| 系列： | SupIRBuck™ |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 1.8V |
| 电流 - 输出： | 0 ~ 6A |
| 输入电压： | 12V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 600kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | IR3856 |
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PD-97528
IR3856MPbF
Solder Resist
IR recommends that the larger Power or Land Area pads are Solder Mask Defined (SMD.) This allows
the underlying Copper traces to be as large as possible, which helps in terms of current carrying
capability and device cooling capability.
When using SMD pads, the underlying copper traces should be at least 0.05mm larger (on each edge)
than the Solder Mask window, in order to accommodate any layer to layer misalignment. (i.e. 0.1mm in X
& Y.)
However, for the smaller Signal type leads around the edge of the device, IR recommends that these are
Non Solder Mask Defined or Copper Defined.
When using NSMD pads, the Solder Resist Window should be larger than the Copper Pad by at least
0.025mm on each edge, (i.e. 0.05mm in X&Y,) in order to accommodate any layer to layer misalignment.
Ensure that the solder resist in-between the smaller signal lead areas are at least 0.15mm wide, due to
the high x/y aspect ratio of the solder mask strip.
Rev 4.0
33
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IRDC3856 - SUPIRBUCK | 制造商:International Rectifier 功能描述:INTERNATIONAL RECIFIER - GEN 2.1 SUPIRBUCK FAMILY - Bulk |
| IRDC3856 | 制造商:International Rectifier 功能描述:; MCU Supported Families:IR3856; Feature |
| IRDC3856W | 功能描述:电源管理IC开发工具 User Guide IR3856W Eval Brd RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| IRDC3859 | 功能描述:电源管理IC开发工具 User Guide IR3859 Eval Brd RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| IRDC3859 - SUPIRBUCK | 制造商:International Rectifier 功能描述:INTERNATIONAL RECIFIER - GEN 2.1 SUPIRBUCK FAMILY - Bulk |
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