参数资料
型号: IRFE330
英文描述: TRANSISTOR | MOSFET | N-CHANNEL | 400V V(BR)DSS | 3A I(D) | LLCC
中文描述: 晶体管| MOSFET的| N沟道| 400V五(巴西)直| 3A条(丁)| LLCC
文件页数: 2/7页
文件大小: 229K
代理商: IRFE330
IRFE320
2
www.irf.com
Thermal Resistance
Parameter
Min Typ Max
Units
Test Conditions
RthJC
RthJ-PCB
Junction to Case
Junction to PC Board
— 26
"""
Soldered to a copper clad PC board
9.1
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ
Max Units
Test Conditions
IS
ISM
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode)
1.8
7.2
VSD
trr
QRR
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
1.4
650
5.0
V
nS
μc
T
j
= 25°C, IS = 1.8A, VGS = 0V
Tj = 25°C, IF = 1.8A, di/dt
100A/
μ
s
VDD
50V
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
A
For footnotes refer to the last page
Electrical Characteristics
@ Tj = 25°C (Unless Otherwise Specified)
Parameter
Drain-to-Source Breakdown Voltage
Temperature Coefficient of Breakdown
Voltage
Static Drain-to-Source On-State
Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
Min
400
Typ
0.37
Max Units
Test Conditions
VGS = 0V, ID = 1.0mA
Reference to 25°C, ID = 1.0mA
BVDSS
BVDSS/
TJ
V
V/°C
RDS(on)
2.0
1.0
— 2.07
VGS =10V, ID =1.8A
— 4.0 V VDS = VGS, ID =250μA
S (
)
25
250
VGS = 0V, TJ = 125°C
100
-100
15.5
2.6
nC
8.3
40
35
60
35
6.1
nH
Measured from the center of
drain pad to center of source
pad
1.8
VGS = 10V, ID = 1.1A
VGS(th)
gfs
IDSS
VDS > 15V, IDS =1.1A
VDS=320V, VGS=0V
VDS =320V
IGSS
IGSS
Qg
Qgs
Qgd
td
(on)
tr
td
(off)
tf
LS + LD
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
VGS = 20V
VGS = -20V
VGS =10V, ID= 1.8A
VDS =200V
VDD =200V, ID =1.8A,
RG =7.5
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
350
100
45
VGS = 0V, VDS = 25V
f = 1.0MHz
pF
nA
n s
μ
A
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