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参数资料
型号： IRFN9140SMD
厂商： SEMELAB LTD
元件分类： JFETs
英文描述： ER 06 20 P/C
中文描述： 14 A, 100 V, 0.22 ohm, P-CHANNEL, Si, POWER, MOSFET
封装： HERMETIC SEALED, SMD1, 3 PIN
文件页数： 2/2页
文件大小： 23K
代理商： IRFN9140SMD
IRFN9140SMD
Prelim. 7/00
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
http://www.semelab.co.uk
Parameter
STATIC ELECTRICAL RATINGS
Test Conditions
Min.
Typ.
Max.
Unit
V
GS
= 0
Reference to 25°C
I
D
= –1mA
V
GS
= –10V
V
GS
= –10V
V
DS
= V
GS
V
DS
3
–15V
V
GS
= 0
I
D
= –1mA
I
D
= –9A
I
D
= –14A
I
D
= –250
m
A
I
DS
= –9A
V
DS
= 0.8BV
DSS
T
J
= 125°C
V
GS
= –20V
V
GS
= 20V
V
GS
= 0
V
DS
= –25V
f = 1MHz
V
GS
= –10V
V
DS
= 0.5BV
DSS
I
D
= –14A
V
DS
= 0.5BV
DSS
I
D
= –14A
V
DD
= –50V
I
D
= –14A
R
G
= 9.1
W
I
S
= –14A
V
GS
= 0
I
F
= –14A
d
i
/ d
t
￡
–100A/
m
s V
DD
￡
–50V
T
J
= 25°C
T
J
= 25°C
ELECTRICAL CHARACTERISTICS
(Tamb= 25°C unless otherwise stated)
Drain – Source Breakdown Voltage
Temperature Coefficient of
Breakdown Voltage
Static Drain – Source On–State
Resistance
1
Gate Threshold Voltage
Forward Transconductance
1
Zero Gate Voltage Drain Current
Forward Gate
– Source Leakage
Reverse Gate
– Source Leakage
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
1
Gate – Source Charge
1
Gate – Drain (“Miller”) Charge
1
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
Continuous Source Current
Pulse Source Current
2
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn–On Time
–100
–0.087
0.20
0.22
–4
–2
6.2
–25
–250
–100
100
1400
600
200
31
60
3.7
7
13
35.2
35
85
85
65
–14
–56
–4.2
280
3.6
negligible
0.8
2.8
V
V/°C
W
V
S
(
(
W
)
m
A
nA
pF
nC
nC
ns
A
V
ns
m
C
nH
BV
DSS
D
BV
DSS
D
T
J
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
I
GSS
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
L
D
L
S
Notes
1) Pulse Test: Pulse Width
￡
300ms,
d ￡
2%
2) Repetitive Rating – Pulse width limited by maximum junction temperature.
DYNAMIC CHARACTERISTICS
SOURCE – DRAIN DIODE CHARACTERISTICS
Internal Drain Inductance
(from centre of drain pad to die)
Internal Source Inductance
(from centre of source pad to end of source bond wire)
PACKAGE CHARACTERISTICS
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