参数资料
型号: IRFR2905ZTRPBF
厂商: International Rectifier
文件页数: 1/11页
文件大小: 0K
描述: MOSFET N-CH 55V 42A DPAK
产品目录绘图: IR Hexfet DPak
标准包装: 1
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 42A
开态Rds(最大)@ Id, Vgs @ 25° C: 14.5 毫欧 @ 36A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 44nC @ 10V
输入电容 (Ciss) @ Vds: 1380pF @ 25V
功率 - 最大: 110W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 标准包装
产品目录页面: 1522 (CN2011-ZH PDF)
其它名称: IRFR2905ZPBFDKR
PD - 95943B
IRFR2905ZPbF
IRFU2905ZPbF
Features
HEXFET ? Power MOSFET
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
Description
This HEXFET ? Power MOSFET utilizes the latest
processing techniques to achieve extremely low
on-resistance per silicon area. Additional features
of this design are a 175°C junction operating
temperature, fast switching speed and improved
repetitive avalanche rating. These features
combine to make this design an extremely efficient
and reliable device for use in a wide variety of
applications.
Absolute Maximum Ratings
G
D
S
D-Pak
IRFR2905ZPbF
V DSS = 55V
R DS(on) = 14.5m ?
I D = 42A
I-Pak
IRFU2905ZPbF
I DM
Parameter
I D @ T C = 25°C Continuous Drain Current, V GS @ 10V (Silicon Limited)
I D @ T C = 100°C Continuous Drain Current, V GS @ 10V
I D @ T C = 25°C Continuous Drain Current, V GS @ 10V (Package Limited)
Pulsed Drain Current
P D @T C = 25°C Power Dissipation
Linear Derating Factor
Max.
59
42
42
240
110
0.72
Units
A
W
W/°C
V GS
E AS (Thermally limited)
E AS (Tested )
I AR
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
± 20
55
82
See Fig.12a, 12b, 15, 16
V
mJ
A
E AR
T J
T STG
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
-55 to + 175
300 (1.6mm from case )
10 lbf in (1.1N m)
mJ
°C
Thermal Resistance
R θ JC
Junction-to-Case
Parameter
Typ.
–––
Max.
1.38
Units
R θ JA
R θ JA
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
–––
–––
40
110
°C/W
HEXFET ? is a registered trademark of International Rectifier.
www.irf.com
1
09/16/10
相关PDF资料
PDF描述
FI212B245026-T FILTER BANDPASS W-LAN BLUETOOTH
MAX2654EXT+T IC AMP LOW NOISE SC70-6
MAX2656EXT+T IC AMP LOW NOISE SC70-6
7W-14.31818MBB-T OSC 14.31818 MHZ 3.3V SMD
MAX2655EXT+T IC AMP LOW NOISE SC70-6
相关代理商/技术参数
参数描述
IRFR2905ZTRR 功能描述:MOSFET N-CH 55V 42A DPAK RoHS:否 类别:分离式半导体产品 >> FET - 单 系列:HEXFET® 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道,金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds(最大)@ Id, Vgs @ 25° C:180 毫欧 @ 9A,10V Id 时的 Vgs(th)(最大):4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件
IRFR2905ZTRRHR 制造商:International Rectifier 功能描述:TRANS MOSFET N-CH 55V 59A 3PIN DPAK - Tape and Reel
IRFR2905ZTRRPBF 功能描述:MOSFET N-CH 55V 42A DPAK RoHS:是 类别:分离式半导体产品 >> FET - 单 系列:HEXFET® 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道,金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds(最大)@ Id, Vgs @ 25° C:180 毫欧 @ 9A,10V Id 时的 Vgs(th)(最大):4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件
IRFR310 功能描述:MOSFET N-Chan 400V 1.7 Amp RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
IRFR3103 功能描述:MOSFET N-CH 400V 1.7A DPAK RoHS:否 类别:分离式半导体产品 >> FET - 单 系列:HEXFET® 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道,金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds(最大)@ Id, Vgs @ 25° C:180 毫欧 @ 9A,10V Id 时的 Vgs(th)(最大):4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件