参数资料
型号: IRFR3910TRL
厂商: International Rectifier
文件页数: 2/11页
文件大小: 0K
描述: MOSFET N-CH 100V 16A DPAK
产品目录绘图: IR Hexfet DPak
标准包装: 3,000
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 16A
开态Rds(最大)@ Id, Vgs @ 25° C: 115 毫欧 @ 10A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 44nC @ 10V
输入电容 (Ciss) @ Vds: 640pF @ 25V
功率 - 最大: 79W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
IRFR/U3910
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
100
–––
––– V V GS = 0V, I D = 250μA
? V (BR)DSS / ? T J
Breakdown Voltage Temp. Coefficient
–––
0.12
–––
V/°C
Reference to 25°C, I D = 1mA
––– R G = 12 ?
R DS(on)
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
–––
2.0
6.4
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
6.4
27
37
25
0.115 V GS = 10V, I D = 10A ?
4.0 V V DS = V GS , I D = 250μA
––– S V DS = 50V, I D = 9.0A ?
25 V DS = 100V, V GS = 0V
μA
250 V DS = 80V, V GS = 0V, T J = 150°C
100 V GS = 20V
nA
-100 V GS = -20V
44 I D = 9.0A
6.2 nC V DS = 80V
21 V GS = 10V, See Fig. 6 and 13 ??
––– V DD = 50V
––– I D = 9.0A
ns
––– R D = 5.5 ?, See Fig. 10 ??
L D
Internal Drain Inductance
–––
4.5
–––
nH
Between lead,
6mm (0.25in.)
D
L S
Internal Source Inductance
–––
7.5
–––
from package
and center of die contact ?
G
S
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
640
160
88
––– V GS = 0V
––– pF V DS = 25V
––– ? = 1.0MHz, See Fig. 5 ?
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ??
––– –––
––– –––
16
60
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
G
D
S
V SD
t rr
Q rr
t on
Notes:
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
––– ––– 1.3 V T J = 25°C, I S = 9.0A, V GS = 0V ?
––– 130 190 ns T J = 25°C, I F = 9.0A
––– 650 970 nC di/dt = 100A/μs ??
Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D )
? Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
? V DD = 25V, starting T J = 25°C, L = 3.1mH
R G = 25 ? , I AS = 9.0A. (See Figure 12)
? Pulse width ≤ 300μs; duty cycle ≤ 2%
? This is applied for I-PAK, Ls of D-PAK is measured between lead and
center of die contact
? I SD ≤ 9.0A, di/dt ≤ 520A/μs, V DD ≤ V (BR)DSS , ? Uses IRF530N data and test conditions
T J ≤ 175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
2
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