参数资料
型号: IRFZ48NSTRR
厂商: International Rectifier
文件页数: 1/11页
文件大小: 0K
描述: MOSFET N-CH 55V 64A D2PAK
标准包装: 800
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 64A
开态Rds(最大)@ Id, Vgs @ 25° C: 14 毫欧 @ 32A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 81nC @ 10V
输入电容 (Ciss) @ Vds: 1970pF @ 25V
功率 - 最大: 3.8W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 带卷 (TR)
PD - 9.1408B
IRFZ48NS
l
l
Advanced Process Technology
Surface Mount (IRFZ48NS)
IRFZ48NL
HEXFET ? Power MOSFET
l
l
l
Low-profile through-hole (IRFZ48NL)
175°C Operating Temperature
Fast Switching
D
V DSS = 55V
l Fully Avalanche Rated
Description
Advanced HEXFET ? Power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance
per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that
HEXFET power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable
device for use in a wide variety of applications.
The D 2 Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-resistance
G
S
R DS(on) = 0.014 ?
I D = 64A
D P ak
in any existing surface mount package. The D 2 Pak is
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0W
in a typical surface mount application.
The through-hole version (IRFZ48NL) is available for low-
profile applications.
Absolute Maximum Ratings
Parameter
Max.
2
T O -26 2
Units
I D @ T C = 25 ° C
Continuous Drain Current, V GS @ 10V
64
I D @ T C = 100 ° C
I DM
P D @T A = 25 ° C
P D @T C = 25 ° C
V GS
I AR
E AR
dv/dt
Continuous Drain Current, V GS @ 10V
Pulsed Drain Current ?
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current ?
Repetitive Avalanche Energy ?
Peak Diode Recovery dv/dt ?
45
210
3.8
130
0.83
± 20
32
13
5.0
A
W
W
W/ ° C
V
A
mJ
V/ns
T J
T STG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
-55 to + 175
300 (1.6mm from case )
° C
Thermal Resistance
Parameter
Typ.
Max.
Units
R qJC
R qJA
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
–––
–––
1.15
40
° C/W
www.irf.com
1
03/12/01
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