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参数资料
| 型号： | IRGC10B60KB |
| 元件分类： | IGBT 晶体管 |
| 英文描述： | 600 V, N-CHANNEL IGBT |
| 封装： | 150 MM, WAFER |
| 文件页数： | 1/1页 |
| 文件大小： | 15K |
| 代理商： | IRGC10B60KB |
IRGC10B60KB
www.irf.com
04/19/02
Die in Wafer Form
Mechanical Data
Electrical Characteristics (Wafer Form)
Die Outline
Nominal Backmetal Composition, (Thickness)
Al - Ti - Ni/V - Ag, (1kA - 1kA - 4kA - 6kA)
Nominal Front Metal Composition, (Thickness)
99% Al/1% Si, (4m)
Dimensions
0.130" x 0.130"
Wafer Diameter
150mm, with std. < 100 > flat
Wafer Thickness, Tolerance
85m, +/- 7m
Relevant Die Mechanical Dwg. Number
01-5514
Minimum Street Width
100m
Reject Ink Dot Size
0.25mm diameter minimum
Ink Dot Location
Consistent throughout same wafer lot
Recommended Storage Environment
Store in original container, in dessicated
nitrogen, with no contamination
Recommended Die Attach Conditions
For optimum electrical results, die attach
temperature should not exceed 300°C
Parameter
Description
Guaranteed (min, max)
Test Conditions
VCE (on)
Collector-to-Emitter Saturation Voltage
0.95V min, 1.3V max
IC = 2A, TJ = 25°C, VGE = 15V
V(BR)CES
Colletor-to-Emitter Breakdown Voltage
600V min
TJ = 25°C, ICES = 1mA, VGE = 0V
VGE(th)
Gate Threshold Voltage
3.5V min, 5.5V max
VGE = VCE , TJ =25°C, IC = 250A
ICES
Zero Gate Voltage Collector Current
10A max
TJ = 25°C, VCE = 600V
IGES
Gate-to-Emitter Leakage Current
± 1.1A max
TJ = 25°C, VGE = +/-20V
E
C
G
600V
IC(nom)= 10A
VCE(on) typ.=1.8V @
IC(nom) @ 25°C
Motor Control IGBT
Short Circuit Rated
150mm Wafer
Features
GEN5 Non Punch Through (NPT) Technology
Low VCE(on)
10s Short Circuit Capability
Square RBSOA
Positive VCE(on) Temperature Coefficient
Benefits
Benchmark Efficiency for Motor Control Applications
Rugged Transient Performance
Excellent Current Sharing in Parallel Operation
Qualified for Industrial Market
Reference Standard IR Package Part: IRGS10B60KD
GAT E
2.27
[.089]
2.34
[.092]
0.64
[.025]
0.66
[.026]
EMITT ER
3.30
[.130]
3.30
[.130]
1. ALL DIMENSIONS ARE S HOWN IN MILLIMET ERS [INCHES].
4. DIMENSIONAL T OLERANCES:
3. LET TER DES IGNATION:
2. CONTROLLING DIMENS ION: [INCH].
NOTES :
WIDTH
< [.050] TOLERANCE = + /- [.004]
> [.050] TOLERANCE = + /- [.008]
> 1.270 TOLERANCE = + /- 0.203
&
LENGTH
> [.0250] T OLERANCE = + /- [.0010]
> 0.635 TOLERANCE = +/- 0.025
< [.0250] T OLERANCE = + /- [.0005]
< 0.635 TOLERANCE = +/- 0.013
< 1.270 TOLERANCE = + /- 0.102
&
LENGTH
OVERALL DIE:
WIDTH
BONDING PADS:
SK = SOURCE KELVIN
IS = CURRENT SENS E
G = GATE
S = SOURCE
E = EMITTER
PD - 94409
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