参数资料
型号: IRMD22141SS
厂商: International Rectifier
文件页数: 2/22页
文件大小: 0K
描述: KIT DESIGN EVAL BOARD/IR22141SS
标准包装: 1
系列: HVIC
主要目的: 电源管理,半 H 桥驱动器(外部 FET)
已用 IC / 零件: IR22141SS
已供物品: 板,文档
相关产品: IR22141SSTRPBF-ND - IC DVR HALF BRIDGE IC 24SSOP
IR22141SSPBF-ND - IC DRIVER HALF BRIDGE SGL 24SSOP
IR22141SS-ND - IC DRIVER HALF BRIDGE SGL 24SSOP
其它名称: *IRMD22141SS
Datasheet rev 2.1
IRMD22141SS
Table of contents
INTRODUCTION .........................................................................................................................................1
Table of contents......................................................................................................................................2
Table of figures ........................................................................................................................................2
The IR22141SS........................................................................................................................................3
The power module ...................................................................................................................................3
Important Notice.......................................................................................................................................3
BOARD CONNECTORS .............................................................................................................................4
Connection with the system controller .....................................................................................................4
FAULT/SD logic signal .............................................................................................................................5
VCC supply pin ........................................................................................................................................5
VSS ground pin (GND).............................................................................................................................5
Connecting the current sensors ...............................................................................................................5
High power signal connector....................................................................................................................6
Connecting the power module .................................................................................................................6
Test Points ...............................................................................................................................................7
TEST BENCH CONNECTION ....................................................................................................................7
OPERATING DESCRIPTION......................................................................................................................8
Power on sequence .................................................................................................................................8
Normal operating mode............................................................................................................................8
Fault management ...................................................................................................................................8
Multilevel board solution...........................................................................................................................9
BOARD SOLUTIONS................................................................................................................................10
Bootstrap circuit .....................................................................................................................................10
Gate resistances ....................................................................................................................................10
OTHER EXTRA COMPONENTS ..............................................................................................................11
Desat circuit ...........................................................................................................................................11
Clamping Diode for Vs below ground ....................................................................................................11
RC filter on com pin................................................................................................................................12
Fast diode between gate and supply pin ...............................................................................................13
Zener diode to preserve the IGBT gate .................................................................................................13
Optional output shunt resistor ................................................................................................................14
Resistor on v cc ........................................................................................................................................14
BILL OF MATERIAL .................................................................................................................................15
SCHEMATIC .............................................................................................................................................16
LAYOUT ....................................................................................................................................................16
LAYOUT ....................................................................................................................................................17
Table of figures
Figure 1: TOP image of board .....................................................................................................................4
Figure 2: LED connection ............................................................................................................................5
Figure 3: Test bench connection .................................................................................................................7
Figure 4: Power on sequence......................................................................................................................8
Figure 5: Three phase connection...............................................................................................................9
Figure 6: Example of a desaturation detection event ..................................................................................9
Figure 7: Bootstrap circuit..........................................................................................................................10
Figure 8: Desat external filter ....................................................................................................................11
Figure 9: -V s clamp ....................................................................................................................................12
Figure 10: COM below ground protection..................................................................................................12
Figure 11: Collector-Gate current protection .............................................................................................13
Figure 12: Zener clamp for IGBT gate.......................................................................................................13
Sep 9 , 2004
www.irf.com
page 2/22
th
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