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参数资料
| 型号： | IRP2166 |
| 厂商： | International Rectifier |
| 元件分类： | 基准电压源/电流源 |
| 英文描述： | PFC & BALLAST CONTROL IC |
| 中文描述： | 功率因数校正 |
| 文件页数： | 2/32页 |
| 文件大小： | 616K |
| 代理商： | IRP2166 |
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IR2166 & (PbF)
2
www.irf.com
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
Note 1:
This IC contains a zener clamp structure between the chip V
CC
and COM which has a nominal breakdown
voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source
greater than the V
CLAMP
specified in the Electrical Characteristics section.
Symbol Definition
Min.
Max.
Units
V
B
High side floating supply voltage
-0.3
625
V
S
High side floating supply offset voltage
V
B
- 25
V
B
+ 0.3
V
HO
High side floating output voltage
V
S
- 0.3
V
B
+ 0.3
V
LO
Low side output voltage
-0.3
V
CC
+ 0.3
V
PFC
PFC gate driver output voltage
-0.3
V
CC
+ 0.3
I
OMAX
Maximum allowable output current (HO, LO, PFC)
-500
500
due to external power transistor miller effect
V
BUS
V
BUS
pin voltage
-0.3
V
CC
+ 0.3
V
CT
CT pin voltage
-0.3
V
CC
+ 0.3
I
CPH
CPH pin current
-5
5
I
RPH
RPH pin current
-5
5
V
RPH
RPH pin voltage
-0.3
V
CC
+ 0.3
V
I
RT
RT pin current
-5
5
mA
V
RT
RT pin voltage
-0.3
V
CC
+ 0.3
V
CS
Current sense pin voltage
-0.3
5.5
I
CS
Current sense pin current
-5
5
I
SD/EOL
Shutdown pin current
-5
5
I
CC
Supply current (Note 1)
-20
20
I
ZX
PFC inductor current, zero crossing detection input current
-5
5
I
COMP
PFC error compensation current
-5
5
dV/dt
Allowable offset voltage slew rate
-50
50
V/ns
P
D
Package power dissipation @ T
A
≤
+25
°
C
(16-Pin PDIP)
—
1.80
P
D =
(T
JMAX
-T
A
)/Rth
JA
(16-Pin SOIC)
—
1.40
Rth
JA
Thermal resistance, junction to ambient
(16-Pin PDIP)
—
70
(16-Pin SOIC)
—
86
T
J
Junction temperature
-55
150
T
S
Storage temperature
-55
150
T
L
Lead temperature (soldering, 10 seconds)
—
300
V
mA
mA
V
mA
V
W
o
C/W
o
C
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