page 6
IRPT3054A
Mounting, Hookup and Application Instructions
Mounting
1. Connect the driver board and the IRPT3054A module.
2. Remove all particles and grit from the heat sink and power
substrate.
3. Spread a .004" to .005" layer of silicone grease on the heat
sink, covering the entire area that the power substrate will
occupy. Recommended heat sink flatness in .001 inch/inch and
Total Indicator Readout (TIR) of .003 inch below substrate.
4. Place the power substrate onto the heat sink with the
mounting holes aligned and press it firmly into the silicone
grease.
5. Insert the two M4 mounting screws through the PCB and
power module and into the heat sink and tighten the screws to
1 Nm torque.
Figure 6.
Power Module Mounting Screw Sequence
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Pow er Connections
The power module pin designation, function and other details
can be obtained from the package outline (figure 7) and circuit
diagram (figure 8). 3-phase input connections are made to pins
R, S and T and inverter output connections are made to pins U,
V and W. Positive DC bus and brake IGBT collector
connections are brought out to pins P and BR, respectively.
Positive rectifier output and positive inverter bus are brought out
to pins RP and P, respectively in order to provide DC bus
capacitor soft charging implementation option. The current
shunt terminals are connected to pins IS1, IS2 and IS3, IS4 on
the positive and negative DC rails, respectively.