参数资料
型号: IRU1260CPTR
厂商: International Rectifier
文件页数: 5/12页
文件大小: 0K
描述: IC CONV PENTIUM P55C 7-UTHINPAK
标准包装: 2,000
应用: 转换器,Intel Pentium?,P55C
输入电压: 3 V ~ 7 V
输出数: 2
输出电压: 1.2 V ~ 5.5 V
工作温度: 0°C ~ 150°C
安装类型: 表面贴装
封装/外壳: 7-超薄封装
供应商设备封装: 7-Ultra Thin-Pak?
包装: 带卷 (TR)
其它名称: IRU1260-CPTR
IRU1260-CPTR-ND
IRU1260
Stability
The IRU1260 requires the use of an output capacitor as
part of the frequency compensation in order to make the
regulator stable. Typical designs for the microprocessor
applications use standard electrolytic capacitors with
typical ESR in the range of 50 to 100m V and the output
capacitance of 500 to 1000 m F. Fortunately as the ca-
pacitance increases, the ESR decreases resulting in a
fixed RC time constant. The IRU1260 takes advantage
of this phenomena in making the overall regulator loop
stable. For most applications a minimum of 100 m F alu-
minum electrolytic capacitor with the maximum ESR of
0.3 V such as Sanyo, MVGX series, Panasonic FA se-
ries as well as the Nichicon PL series insures both sta-
bility and good transient response. The IRU1260 also
requires a 1 m F ceramic capacitor connected from V IN to
V CTRL and a 10 V , 0.1W resistor in series with V CTRL pin
in order to further insure stability.
Thermal Design
The IRU1260 incorporates an internal thermal shutdown
that protects the device when the junction temperature
exceeds the maximum allowable junction temperature.
Although this device can operate with junction tempera-
tures in the range of 150 8 C, it is recommended that the
selected heat sink be chosen such that during maxi-
mum continuous load operation the junction tempera-
ture is kept below this number. The example given shows
the steps in selecting the proper regulator heat sink for
driving the Pentium II TM processor GTL+ termination
resistors and the Clock IC using the IRU1260 TO-263
package.
Example :
Assuming the following specifications:
V IN = 3.3V
V OUT1 = 2.5V
V OUT2 = 1.5V
I OUT1(MAX) = 0.2A
I OUT2(MAX) = 1.5A
T A = 35 8 C
The steps for selecting a proper heat sink to keep the
junction temperature below 135 8 C is given as:
1) Calculate the maximum power dissipation using:
P D = I OUT1 3 (V IN - V OUT1 ) + I OUT2 3 (V IN - V OUT2 )
P D = 0.2 3 (3.3 - 2.5) + 1.5 3 (3.3 - 1.5) = 2.86W
2) Assuming a TO-263 surface mount package, the junc-
tion to ambient thermal resistance of the package is:
u JA = 30 8 C/W for 1" square pad area
3) The maximum junction temperature of the device is
calculated using the equation below:
T J = T A + P D 3u JA
T J = 35 + 2.86 3 30 = 121 8 C
Since this is lower than our selected 135 8 C maxi-
mum junction temperature (150 8 C is the thermal shut-
down of the device), TO-263 package is a suitable
package for our application.
Rev. 2.1
09/19/02
www.irf.com
5
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