参数资料
型号: IS82C54Z96
厂商: Intersil
文件页数: 14/22页
文件大小: 0K
描述: IC OSC PROG TIMER 8MHZ 28PLCC
标准包装: 750
类型: 可编程计时器
频率: 8MHz
电源电压: 4.5 V ~ 5.5 V
电流 - 电源: 10mA
工作温度: -40°C ~ 85°C
封装/外壳: 28-LCC(J 形引线)
包装: 带卷 (TR)
供应商设备封装: 28-PLCC(11.51x11.51)
安装类型: 表面贴装
21
82C54
Ceramic Leadless Chip Carrier Packages (CLCC)
D
j x 45o
D3
B
h x 45o
A
A1
E
L
L3
e
B3
L1
D2
D1
e1
E2
E1
L2
PLANE 2
PLANE 1
E3
B2
0.010
E H
S
0.010
E F
S
-E-
0.007
E F
M
S HS
B1
-H-
-F-
J28.A MIL-STD-1835 CQCC1-N28 (C-4)
28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.060
0.100
1.52
2.54
6, 7
A1
0.050
0.088
1.27
2.23
-
B
----
-
B1
0.022
0.028
0.56
0.71
2, 4
B2
0.072 REF
1.83 REF
-
B3
0.006
0.022
0.15
0.56
-
D
0.442
0.460
11.23
11.68
-
D1
0.300 BSC
7.62 BSC
-
D2
0.150 BSC
3.81 BSC
-
D3
-
0.460
-
11.68
2
E
0.442
0.460
11.23
11.68
-
E1
0.300 BSC
7.62 BSC
-
E2
0.150 BSC
3.81 BSC
-
E3
-
0.460
-
11.68
2
e
0.050 BSC
1.27 BSC
-
e1
0.015
-
0.38
-
2
h
0.040 REF
1.02 REF
5
j
0.020 REF
0.51 REF
5
L
0.045
0.055
1.14
1.40
-
L1
0.045
0.055
1.14
1.40
-
L2
0.075
0.095
1.90
2.41
-
L3
0.003
0.015
0.08
0.038
-
ND
7
3
NE
7
3
N28
28
3
Rev. 0 5/18/94
NOTES:
1. Metallized castellations shall be connected to plane 1 terminals
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
2. Unless otherwise specified, a minimum clearance of 0.015 inch
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
4. The required plane 1 terminals and optional plane 2 terminals (if
used) shall be electrically connected.
5. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.
6. Chip carriers shall be constructed of a minimum of two ceramic
layers.
7. Dimension “A” controls the overall package thickness. The maxi-
mum “A” dimension is package height before being solder dipped.
8. Dimensioning and tolerancing per ANSI Y14.5M-1982.
9. Controlling dimension: INCH.
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