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| 型号： | ISD17180PYI |
| 厂商： | Nuvoton Technology Corporation of America |
| 文件页数： | 8/24页 |
| 文件大小： | 0K |
| 描述： | IC VOICE REC/PLAY 180SEC 28-DIP |
| 标准包装： | 15 |
| 系列： | ISD1700, ChipCorder® |
| 接口： | SPI |
| 持续时间： | 180 秒 |
| 安装类型： | 通孔 |
| 封装/外壳： | 28-DIP（0.600"，15.24mm） |
| 供应商设备封装： | 28-DIP |
| 配用： | ISD-COB1790-ND - BOARD DEMO FOR ISD1790 ISD-COB1760-ND - BOARD DEMO FOR ISD1760 ISD-COB1750-ND - BOARD DEMO FOR ISD1750 ISD-COB1740-ND - BOARD DEMO FOR ISD1740 ISD-COB1730-ND - BOARD DEMO FOR ISD1730 ISD-COB17240-ND - BOARD DEMO FOR ISD17240 ISD-COB17210-ND - BOARD DEMO FOR ISD17210 ISD-COB17150-ND - BOARD DEMO FOR ISD17150 ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES |
PRELIMINARY ISD1700 SERIES
Publication Release Date: Nov 6, 2008
- 16 -
Revision 1.31
10
9
TYPICAL APPLICATION CIRCUITS
The following typical applications examples on ISD1700 Series are for references only. They make no
representation or warranty that such applications shall be suitable for the use specified. Each design
has to be optimized in its own system for the best performance on voice quality, current consumption,
functionalities and etc.
The below notes apply to the following applications examples:
*
These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirements, they can be 10
μF, 4.7 μF or other values.
Please refer to the applications notes or consult Nuvoton for layout advice.
** It is important to have a separate path for each ground and power back to the related terminals to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible
.
Example #1: Recording using microphone input via push-button controls
Vcc
ISD1700
R
OSC
V
CCA
SP+
AUD/AUX
ERASE
PLAY
REC
AGC
V
SSD
V
CCD
AnaIn
MIC -
MIC+
MISO
MOSI
SCLK
SS
FWD
VOL
V
CCA
0.1 F
μ
V
CCD
*
24
23
25
26
19
10
11
20
18
1
28
17
22
9
V
CCA
V
CCD
V
CCP
V
SSA
V
CCP
V
SSP1
SP-
V
SSP2
V
CCP
0.1 F
μ
0.1 F
μ
*
21
8
14
16
12
0.1 F
μ
*
INT/RDY
27
7
6
5
4
V
CC
4.7 F
μ
Ω
4.7 K
0.1 F
μ
4.7 K
Ω
0.1 F
μ
4.7 K
Ω
**
*** At 8kHz sampling freq, Rosc = 80 K
Rosc ***
4.7 F
μ
FT
15
13
Speaker
or Buzzer
V
CCD
Optional
Ω
100 K
Optional: based upon the applications
390
Ω
0.1 F
μ
V
CC
8050C
Speaker
AUX
AUD
Gnd
LED
1 K
Ω
D1
2
vAlert
3
RESET
0.1 F
μ
Reset
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
相关PDF资料 |
PDF描述 |
|---|---|
| ISD17210EYI | IC VOICE REC/PLAY 210SEC 28-TSOP |
| ISD17210SY | IC VOICE REC/PLAY 210SEC 28-SOIC |
| ISD17210PY | IC VOICE REC/PLAY 210SEC 28-DIP |
| VE-21V-CV-S | CONVERTER MOD DC/DC 5.8V 150W |
| VE-21R-CV-S | CONVERTER MOD DC/DC 7.5V 150W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISD17180PYI01 | 功能描述:IC VOICE REC/PLAY 180SEC 28-DIP RoHS:是 类别:集成电路 (IC) >> 接口 - 语音录制和重放 系列:ISD1700, ChipCorder® 标准包装:14 系列:- 接口:串行 滤波器通频带:1.7kHz 持续时间:8 ~ 32 秒 安装类型:通孔 封装/外壳:28-DIP（0.300"，7.62mm） 供应商设备封装:28-PDIP 其它名称:90-21300+000 |
| ISD17180PYIR | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180PYIR01 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180PYR | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180PYR01 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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