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参数资料
| 型号： | ISD1750SYR |
| 厂商： | Nuvoton Technology Corporation of America |
| 文件页数： | 4/24页 |
| 文件大小： | 0K |
| 描述： | IC VOICE REC/PLAY 50SEC 28-SOIC |
| 标准包装： | 1,000 |
| 系列： | ISD1700, ChipCorder® |
| 接口： | SPI |
| 持续时间： | 50 秒 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 28-SOIC |
| 配用： | ISD-COB1790-ND - BOARD DEMO FOR ISD1790 ISD-COB1760-ND - BOARD DEMO FOR ISD1760 ISD-COB1750-ND - BOARD DEMO FOR ISD1750 ISD-COB1740-ND - BOARD DEMO FOR ISD1740 ISD-COB1730-ND - BOARD DEMO FOR ISD1730 ISD-COB17240-ND - BOARD DEMO FOR ISD17240 ISD-COB17210-ND - BOARD DEMO FOR ISD17210 ISD-COB17150-ND - BOARD DEMO FOR ISD17150 ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES |
PRELIMINARY ISD1700 SERIES
Publication Release Date: Nov 6, 2008
- 12 -
Revision 1.31
7.2
16
SPI OPERATION
T
SSH
T
SSmin
T
SCKhi
T
SSS
T
DIS
T
DIH
T
SCKlow
T
DF
(TRISTATE)
SS
SCLK
MOSI
MISO
LSB
T
PD
MSB
LSB
MSB
Figure 12.8: SPI Operation
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
SS Setup Time
TSSS
500
nsec
SS Hold Time
TSSH
500
nsec
Data in Setup Time
TDIS
200
nsec
Data in Hold Time
TDIH
200
nsec
Output Delay
TPD
500
nsec
Output Delay to HighZ
TDF
500
nsec
SS HIGH
TSSmin
1
sec
SCLK High Time
TSCKhi
400
nsec
SCLK Low Time
TSCKlow
400
nsec
CLK Frequency
F0
1,000
KHz
Power-Up Delay
[1]
TPUD
50
msec
Notes:
[1] The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for slower
sampling frequency.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISD1750SYR01 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1750XY | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1750XY01 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1750XYI | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1750XYI01 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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