型号: | ISD1790SYR |
厂商: | Nuvoton Technology Corporation of America |
文件页数: | 16/24页 |
文件大小: | 0K |
描述: | IC VOICE REC/PLAY 90SEC 28-SOIC |
标准包装: | 1,000 |
系列: | ISD1700, ChipCorder® |
接口: | SPI |
持续时间: | 90 秒 |
安装类型: | 表面贴装 |
封装/外壳: | 28-SOIC(0.295",7.50mm 宽) |
供应商设备封装: | 28-SOIC |
配用: | ISD-COB1790-ND - BOARD DEMO FOR ISD1790 ISD-COB1760-ND - BOARD DEMO FOR ISD1760 ISD-COB1750-ND - BOARD DEMO FOR ISD1750 ISD-COB1740-ND - BOARD DEMO FOR ISD1740 ISD-COB1730-ND - BOARD DEMO FOR ISD1730 ISD-COB17240-ND - BOARD DEMO FOR ISD17240 ISD-COB17210-ND - BOARD DEMO FOR ISD17210 ISD-COB17150-ND - BOARD DEMO FOR ISD17150 ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES |
相关PDF资料 |
PDF描述 |
---|---|
ISD1790EYR | IC VOICE REC/PLAY 90SEC 28-TSOP |
VE-232-CV-S | CONVERTER MOD DC/DC 15V 150W |
MAXQ612G-0000+ | IC MCU 16BIT 128KB IR MOD 64LQFP |
VI-25T-CV-S | CONVERTER MOD DC/DC 6.5V 150W |
ISD1750EYIR | IC VOICE REC/PLAY 50SEC 28-TSOP |
相关代理商/技术参数 |
参数描述 |
---|---|
ISD1790SYR01 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
ISD1790XY | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
ISD1790XY01 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
ISD1790XYI | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
ISD1790XYI01 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |