参数资料
型号: ISD2590
厂商: WINBOND ELECTRONICS CORP
英文描述: ISD2560
中文描述: ISD2560
文件页数: 4/42页
文件大小: 380K
代理商: ISD2590
ISD2560/75/90/120
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4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS...................................................................................................................... 4
5. PIN CONFIGURATION....................................................................................................................... 5
6. PIN DESCRIPTION............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10
7.1. Detailed Description.................................................................................................................... 10
7.2. Operational Modes ..................................................................................................................... 11
7.2.1. Operational Modes Description............................................................................................ 12
8. TIMING DIAGRAMS.......................................................................................................................... 16
9. ABSOLUTE MAXIMUM RATINGS....................................................................................................19
9.1 Operating Conditions................................................................................................................... 20
10. ELECTRICAL CHARACTERISTICS............................................................................................... 21
10.1. Parameters For Packaged Parts.............................................................................................. 21
10.1.1. Typical Parameter Variation with Voltage and Temperature............................................. 24
10.2. Parameters For Die .................................................................................................................. 25
10.2.1. Typical Parameter Variation with Voltage and Temperature............................................. 28
10.3. Parameters For Push-Button Mode.......................................................................................... 29
11. TYPICAL APPLICATION CIRCUIT................................................................................................. 30
12. PACKAGE DRAWING AND DIMENSIONS.................................................................................... 35
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 36
12.3. 28-Lead 8x13.4MM Plastic Thin Small Outline Package (TSOP) Type 1................................ 37
12.4. ISD2560/75/95/120 Product Bonding Physical Layout (Die)
[1]
................................................ 38
14. VERSION HISTORY ....................................................................................................................... 41
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ISD2590G 制造商:未知厂家 制造商全称:未知厂家 功能描述:
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ISD2590PRODUCTS 制造商:未知厂家 制造商全称:未知厂家 功能描述: