参数资料
| 型号： | ISL12058IUZ |
| 厂商： | Intersil |
| 文件页数： | 14/19页 |
| 文件大小： | 0K |
| 描述： | IC RTC/CALENDAR I2C-BUS 8-MSOP |
| 标准包装： | 50 |
| 类型： | 时钟/日历 |
| 特点： | 警报器，闰年 |
| 时间格式： | HH:MM:SS（12/24 小时） |
| 数据格式： | YY-MM-DD-dd |
| 接口： | I²C，2 线串口 |
| 电源电压： | 1.8 V ~ 3.6 V |
| 电压 - 电源，电池： | 1.4 V ~ 1.8 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 管件 |
4
FN6756.0
June 15, 2009
Absolute Maximum Ratings
Thermal Information
Voltage on VDD Pin (respect to GND) . . . . . . . . . . . . . . . -0.2V to 4V
Voltage on IRQ/FOUT , SCL and SDA Pins
(respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 6V
Voltage on X1 and X2 Pins (respect to GND) . . . . . . . . . -0.2V to 4V
ESD Rating ((Per MIL-STD-883 Method 3014)
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>4kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>350V
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
8 Lead SOIC (Note 3) . . . . . . . . . . . . .
120
N/A
8 Lead MSOP (Note 3). . . . . . . . . . . . .
169
N/A
8 Lead TDFN (Note 3) . . . . . . . . . . . .
160
N/A
8 Lead TDFN (Notes 4, 5) . . . . . . . . . .
52
7
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
3.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4.
θ
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
5. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
DC Operating Characteristics – RTC Temperature = -40°C to +85°C unless otherwise stated.
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 8)
TYP
(Note 7)
MAX
(Note 8)
UNITS
NOTES
VDD
Main Power Supply
1.8
3.6
V
VDDT
Timekeeping Power Supply
1.4
1.8
V
IDD1
Standby Supply Current
VDD = 3.6V
600
950
nA
VDD = 3.0V
500
nA
IDD2
Timekeeping Current
VDD = 1.8V
400
650
nA
VDD = 1.4V
350
nA
IDD3
Supply Current With I2C Active at
Clock Speed of 400kHz
VDD = 3.6V
15
40
A
ILI
Input Leakage Current on SCL
-100
100
nA
ILO
I/O Leakage Current on SDA
-100
100
nA
IRQ/FOUT
VOL
Output Low Voltage
VDD = 1.8V, IOL = 3mA
0.4
V
Serial Interface Specifications
Over the recommended operating conditions unless otherwise specified.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 8)
TYP (Note 7)
MAX
(Note 8)
UNITS
NOTES
SERIAL INTERFACE SPECS
VIL
SDA and SCL Input Buffer LOW
Voltage
-0.3
0.3 x VDD
V
VIH
SDA and SCL Input Buffer HIGH
Voltage
0.7 x VDD
5.5
V
Hysteresis SDA and SCL Input Buffer
Hysteresis
0.04 x VDD
V
VPULLUP Maximum Pull-up Voltage on SDA
during I2C Communication
VDD + 2
V
VOL
SDA Output Buffer LOW Voltage,
Sinking 3mA
VDD > 1.8V, VPULLUP = 5.0V
0
0.4
V
Cpin
SDA and SCL Pin Capacitance
TA = +25°C, f = 1MHz, VDD = 5V,
VIN =0V, VOUT = 0V
10
pF
fSCL
SCL Frequency
400
kHz
ISL12058
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