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参数资料
| 型号： | ISL1208IU8-TK |
| 厂商： | INTERSIL CORP |
| 元件分类： | XO, clock |
| 英文描述： | I2C Real Time Clock/Calendar |
| 中文描述： | 1 TIMER(S), REAL TIME CLOCK, PDSO8 |
| 封装： | PLASTIC, MO-187AA, MSOP-8 |
| 文件页数： | 18/21页 |
| 文件大小： | 393K |
| 代理商： | ISL1208IU8-TK |
18
FN8085.3
July 29, 2005
A system to implement temperature compensation would
consist of the ISL1208, a temperature sensor, and a
microcontroller. These devices may already be in the system
so the function will just be a matter of implementing software
and performing some calculations. Fairly accurate
temperature compensation can be implemented just by
using the crystal manufacturer’s specifications for the
turnover temperature T
0
and the drift coefficient (
β
). The
formula for calculating the oscillator adjustment necessary
is:
Adjustment (ppm) = (T – T
0
)
2
*
β
Once the temperature curve for a crystal is established, then
the designer should decide at what discrete temperatures
the compensation will change. Since drift is higher at
extreme temperatures, the compensation may not be
needed until the temperature is greater than 20°C from T
0
.
A sample curve of the ATR setting vs. Frequency Adjustment
for the ISL1208 and a typical RTC crystal is given in Figure
18. This curve may vary with different crystals, so it is good
practice to evaluate a given crystal in an ISL1208 circuit
before establishing the adjustment values.
This curve is then used to figure what ATR and DTR settings
are used for compensation. The results would be placed in a
lookup table for the microcontroller to access.
Layout Considerations
The crystal input at X1 has a very high impedance, and
oscillator circuits operating at low frequencies such as
32.768kHz are known to pick up noise very easily if layout
precautions are not followed. Most instances of erratic
clocking or large accuracy errors can be traced to the
susceptibility of the oscillator circuit to interference from
adjacent high speed clock or data lines. Careful layout of the
RTC circuit will avoid noise pickup and insure accurate
clocking.
Figure 19 shows a suggested layout for the ISL1208 device
using a surface mount crystal. Two main precautions should
be followed:
Do not run the serial bus lines or any high speed logic lines
in the vicinity of the crystal. These logic level lines can
induce noise in the oscillator circuit to cause misclocking.
Add a ground trace around the crystal with one end
terminated at the chip ground. This will provide termination
for emitted noise in the vicinity of the RTC device.
In addition, it is a good idea to avoid a ground plane under
the X1 and X2 pins and the crystal, as this will affect the load
capacitance and therefore the oscillator accuracy of the
circuit. If the ~IRQ/F
OUT
pin is used as a clock, it should be
routed away from the RTC device as well. The traces for the
V
BAT
and V
CC
pins can be treated as a ground, and should
be routed around the crystal.
Super Capacitor Backup
The ISL1208 device provides a V
BAT
pin which is used for a
battery backup input. A Super Capacitor can be used as an
alternative to a battery in cases where shorter backup times
are required. Since the battery backup supply current
required by the ISL1208 is extremely low, it is possible to get
months of backup operation using a Super Capacitor.
Typical capacitor values are a few μF to 1 Farad or more
depending on the application.
If backup is only needed for a few minutes, then a small
inexpensive electrolytic capacitor can be used. For extended
periods, a low leakage, high capacity Super Capacitor is the
best choice. These devices are available from such vendors
as Panasonic and Murata. The main specifications include
working voltage and leakage current. If the application is for
charging the capacitor from a +5V ±5% supply with a signal
diode, then the voltage on the capacitor can vary from ~4.5V
to slightly over 5.0V. A capacitor with a rated WV of 5.0V
may have a reduced lifetime if the supply voltage is slightly
high. The leakage current should be as small as possible.
For example, a Super Capacitor should be specified with
leakage of well below 1μA. A standard electrolytic capacitor
with DC leakage current in the microamps will have a
severely shortened backup time.
Below are some examples with equations to assist with
calculating backup times and required capacitance for the
ISL1208 device. The backup supply current plays a major
-40.0
-30.0
-20.0
-10.0
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
0
5
10 15 20 25 30 35 40 45 50 55 60
ATR SETTING
P
FIGURE 18. ATR SETTING vs OSCILLATOR FREQUENCY
ADJUSTMENT
FIGURE 19. SUGGESTED LAYOUT FOR ISL1208 AND
CRYSTAL
ISL1208
相关PDF资料 |
PDF描述 |
|---|---|
| ISL1208IU8Z-TK | I2C Real Time Clock/Calendar |
| ISL1208IB8Z | I2C Real Time Clock/Calendar |
| ISL1208IB8Z-TK | I2C Real Time Clock/Calendar |
| ISL1208IU8 | I2C Real Time Clock/Calendar |
| ISL1208IU8Z | I2C Real Time Clock/Calendar |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL1208IU8Z | 功能描述:实时时钟 I2C REAL TIME CLOCK/ CALENDAR 8LD RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| ISL1208IU8Z-T7A | 功能描述:实时时钟 I2CAL TIME CLK/CLNDR 8LD RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| ISL1208IU8Z-TK | 功能描述:实时时钟 I2CAL TIME CLK/CLNDR 8LD RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| ISL1209 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Low Power RTC with Battery Backed SRAM and Event Detection |
| ISL1209_06 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Low Power RTC with Battery Backed SRAM and Event Detection |
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