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| 型号： | ISL21009BFB825Z |
| 厂商： | Intersil |
| 文件页数： | 16/19页 |
| 文件大小： | 0K |
| 描述： | IC VREF SERIES PREC 2.5V 8-SOIC |
| 产品培训模块： | Solutions for Industrial Control Applications |
| 标准包装： | 100 |
| 系列： | FGA™ |
| 基准类型： | 串联，精度 |
| 输出电压： | 2.5V |
| 容差： | ±0.5% |
| 温度系数： | 3ppm/°C |
| 输入电压： | 3.5 V ~ 16.5 V |
| 通道数： | 1 |
| 电流 - 静态： | 180µA |
| 电流 - 输出： | 7mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
ISL21009
Data Converters in particular can utilize the ISL21009 as an
external voltage reference. Low power DAC and ADC
circuits will realize maximum resolution with lowest noise.
Board Mounting Considerations
For applications requiring the highest accuracy, board
mounting location should be reviewed. The device uses a
plastic SOIC package, which will subject the die to mild
stresses when the Printed Circuit (PC) board is heated and
cooled, slightly changing the shape. Placing the device in
areas subject to slight twisting can cause degradation of the
accuracy of the reference voltage due to these die stresses.
It is normally best to place the device near the edge of a
board, or the shortest side, as the axis of bending is most
limited at that location. Mounting the device in a cutout also
minimizes flex. Obviously mounting the device on flexprint or
extremely thin PC material will likewise cause loss of
reference accuracy.
Board Assembly Considerations
FGA references provide high accuracy and low temperature
drift but some PC board assembly precautions are
necessary. Normal Output voltage shifts of 100μV to 1mV
can be expected with Pb-free reflow profiles or wave solder
on multi-layer FR4 PC boards. Precautions should be taken
to avoid excessive heat or extended exposure to high reflow
or wave solder temperatures, this may reduce device initial
accuracy.
Post-assembly x-ray inspection may also lead to permanent
changes in device output voltage and should be minimized
or avoided. If x-ray inspection is required, it is advisable to
monitor the reference output voltage to verify excessive shift
has not occurred. If large amounts of shift are observed, it is
best to add an X-ray shield consisting of thin zinc (300μm)
sheeting to allow clear imaging, yet block x-ray energy that
affects the FGA reference.
Special Applications Considerations
In addition to post-assembly examination, there are also
plane underneath will effectively shield it from from 50 to 100
passes through the machine. Since these machines vary in
X-ray dose delivered, it is difficult to produce an accurate
maximum pass recommendation.
Noise Performance and Reduction
The output noise voltage in a 0.1Hz to 10Hz bandwidth is
typically 4.5μV P-P . The noise measurement is made with a
bandpass filter made of a 1-pole high-pass filter with a corner
frequency at 0.1Hz and a 2-pole low-pass filter with a corner
frequency (3dB) at 8.2Hz to create a filter with a 9.9Hz
bandwidth. Noise in the 10Hz to 1kHz bandwidth is
approximately 2.2μV P-P with no capacitance on the output.
This noise measurement is made with a 2 decade bandpass
filter made of a 1-pole high-pass filter with a corner frequency
at 1/10 of the center frequency and 1-pole low-pass filter with
a corner frequency at 10x the center frequency. Load
capacitance up to 1000pF can be added but will result in only
marginal improvements in output noise and transient
response.
The output stage of the ISL21009 does not drive heavily
capacitive loads well, so for load capacitances above
0.001μF, the noise reduction network shown in Figure 58 is
recommended. This network reduces noise significantly over
the full bandwidth. Noise is reduced to less than 15μV P-P from
1Hz to 1kHz using this network with a 0.01μF capacitor and a
2k Ω resistor in series with a 10μF capacitor. Also, transient
response is improved. The 0.01μF value can be increased for
better load transient response with little sacrifice in output
stability.
Higher output capacitor values can be used without the RC
network to address transient loads without stability
problems, although there will be more overshoot an longer
settling times with values up to 1.0μF. Output capacitor
values greater than 1.0μF are not recommended for the
ISL21009.
.
V IN = 5.0V
other X-ray sources that may affect the FGA reference long
10μF
V IN
term accuracy. Airport screening machines contain X-rays
and will have a cumulative effect on the voltage reference
output accuracy. Carry-on luggage screening uses low level
X-rays and is not a major source of output voltage shift,
although if a product is expected to pass through that type of
0.1μF
V O
ISL21009-25
GND
0.01μF
2k Ω
10μF
screening over 100 times it may need to consider shielding
with copper or aluminum. Checked luggage X-rays are
higher intensity and can cause output voltage shift in much
fewer passes, so devices expected to go through those
machines should definitely consider shielding. Note that just
two layers of 1/2 ounce copper planes will reduce the
received dose by over 90%. The leadframe for the device
which is on the bottom also provides similar shielding.
If a device is expected to pass through luggage X-ray
machines numerous times, it is advised to mount a 2-layer
(minimum) PC board on the top, and along with a ground
16
FIGURE 58. HANDLING HIGH LOAD CAPACITANCE
Turn-On Time
The ISL21009 devices have low supply current and thus, the
time to bias up internal circuitry to final values will be longer
than with higher power references. Normal turn-on time is
typically 100μs, as shown in Figure 25. Circuit design must
take this into account when looking at power-up delays or
sequencing.
FN6327.7
September 16, 2009
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相关代理商/技术参数 |
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| ISL21009BFB825Z-T7A | 功能描述:基准电压& 基准电流 2 5VF I/A=+/-0 5MV T/C=3PPM RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel |
| ISL21009BFB825Z-TK | 功能描述:基准电压& 基准电流 2 5VFERENCE I/A=+/-0 5MV T/C=3PPM RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel |
| ISL21009BFB841Z | 功能描述:基准电压& 基准电流 096VFERENCE I/A=+/-0 5MV T/C=3PPM RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel |
| ISL21009BFB841Z-TK | 功能描述:基准电压& 基准电流 096VFERENCE I/A=+/-0 5MV T/C=3PPM RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel |
| ISL21009BFB850Z | 功能描述:基准电压& 基准电流 5 0VFERENCE I/A=+/-0 5MV T/C=3PPM RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel |
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