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参数资料
| 型号： | ISL21032DPH306Z-TK |
| 厂商： | Intersil |
| 文件页数： | 5/7页 |
| 文件大小： | 0K |
| 描述： | IC VREF SERIES PREC 0.6V SOT23-3 |
| 标准包装： | 1,000 |
| 系列： | FGA™ |
| 基准类型： | 串联，精度 |
| 输出电压： | 0.6V |
| 容差： | ±6mV |
| 输入电压： | 2.7 V ~ 5.5 V |
| 通道数： | 1 |
| 电流 - 静态： | 25µA |
| 电流 - 输出： | 7mA |
| 工作温度： | -40°C ~ 130°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-236-3，SC-59，SOT-23-3 |
| 供应商设备封装： | SOT-23-3 |
| 包装： | 带卷 (TR) |
ISL21032
Typical Performance Curves, ISL21032 Low Voltage Output Reference
V IN = 3.0V, I OUT = 0mA, T A = +25°C Unless Otherwise Specified (Continued)
120
100
NO LOAD
1nF LOAD
10nF LOAD
80
100nF LOAD
60
40
20
0
1
10
100 1k 10k
100k
1M
FREQUENCY (Hz)
FIGURE 13. Z OUT vs f vs C L
FGA Technology
The ISL21032 series of voltage references use the floating
gate technology to create references with very low drift and
supply current. Essentially the charge stored on a floating
gate cell is set precisely in manufacturing. The reference
voltage output itself is a buffered version of the floating gate
voltage. The resulting reference device has excellent
characteristics which are unique in the industry: very low
temperature drift, high initial accuracy, and almost zero
supply current. Also, the reference voltage itself is not limited
by voltage bandgaps or zener settings, so a wide range of
reference voltages can be programmed (standard voltage
settings are provided, but customer-specific voltages are
available).
The process used for these reference devices is a floating
gate CMOS process, and the amplifier circuitry uses CMOS
transistors for amplifier and output transistor circuitry. While
providing excellent accuracy, there are limitations in output
noise level and load regulation due to the MOS device
characteristics. These limitations are addressed with circuit
techniques discussed in other sections.
Board Mounting Considerations
For applications requiring the highest accuracy, board
mounting location should be reviewed. Placing the device in
areas subject to slight twisting can cause degradation of the
accuracy of the reference voltage due to die stresses. It is
normally best to place the device near the edge of a board,
or the shortest side, as the axis of bending is most limited at
that location. Obviously mounting the device on flexprint or
extremely thin PC material will likewise cause loss of
reference accuracy.
5
10s/DIV
FIGURE 14. V OUT NOISE
Board Assembly Considerations
FGA references provide high accuracy and low temperature
drift but some PC board assembly precautions are
necessary. Normal Output voltage shifts of 100μV to 1mV
can be expected with Pb-free reflow profiles or wave solder
on multi-layer FR4 PC boards. Precautions should be taken
to avoid excessive heat or extended exposure to high reflow
or wave solder temperatures, this may reduce device initial
accuracy.
Post-assembly x-ray inspection may also lead to permanent
changes in device output voltage and should be minimized
or avoided. If x-ray inspection is required, it is advisable to
monitor the reference output voltage to verify excessive shift
has not occurred. If large amounts of shift are observed, it is
best to add an X-ray shield consisting of thin zinc (300μm)
sheeting to allow clear imaging, yet block x-ray energy that
affects the FGA reference.
Special Applications Considerations
In addition to post-assembly examination, there are also
other X-ray sources that may affect the FGA reference long
term accuracy. Airport screening machines contain X-rays
and will have a cumulative effect on the voltage reference
output accuracy. Carry-on luggage screening uses low level
X-rays and is not a major source of output voltage shift,
although if a product is expected to pass through that type of
screening over 100 times it may need to consider shielding
with copper or aluminum. Checked luggage X-rays are
higher intensity and can cause output voltage shift in much
fewer passes, so devices expected to go through those
machines should definitely consider shielding. Note that just
two layers of 1/2 ounce copper planes will reduce the
received dose by over 90%. The leadframe for the device
which is on the bottom also provides similar shielding.
FN6239.2
September 28, 2009
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL21032-EVALZ | 功能描述:电源管理IC开发工具 ISL21032-EVALZ EVAL BRD ROHS COMPLAINT RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| ISL21060 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Precision, Low Noise FGA Voltage References |
| ISL21060BFH620Z-TK | 功能描述:基准电压& 基准电流 048VFERENCE I/A=+/-1 0MV T/C=10PPM RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel |
| ISL21060BFH625Z-TK | 功能描述:基准电压& 基准电流 PBFREE 2 5VFERENCE I/A=+/-1 0MV RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel |
| ISL21060BFH630Z-TK | 功能描述:基准电压& 基准电流 PBFREE 3 0VFERENCE I/A=+/-1 0MV RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel |
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