参数资料
| 型号： | ISL21070DIH306Z-TK |
| 厂商： | Intersil |
| 文件页数： | 7/11页 |
| 文件大小： | 0K |
| 描述： | IC VREF SERIES 0.6V SOT-23-3 |
| 产品培训模块： | Patient Monitoring and Diagnostic Equipment Solutions Solutions for Test and Measurement Equipment |
| 标准包装： | 1 |
| 系列： | FGA™ |
| 基准类型： | 系列 |
| 输出电压： | 0.6V |
| 容差： | ±1% |
| 温度系数： | 50ppm/°C |
| 输入电压： | 2.7 V ~ 5.5 V |
| 通道数： | 1 |
| 电流 - 静态： | 25µA |
| 电流 - 输出： | 10mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-236-3，SC-59，SOT-23-3 |
| 供应商设备封装： | SOT-23-3 |
| 包装： | 标准包装 |
| 其它名称： | ISL21070DIH306Z-TKDKR |
ISL21070
Typical Performance Characteristics Curves
V OUT = 2.5V, V IN = 3V, I OUT = 0mA, T A = +25°C unless otherwise specified. (Continued)
120
100
80
60
40
NO LOAD
1nF LOAD
10nF LOAD
100nF LOAD
0
-10
-20
-30
-40
-50
-60
-70
1nF LOAD
10nF LOAD
NO LOAD
100nF LOAD
20
-80
-90
0
1
10
100
1k
10k
100k
1M
-100
1
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FIGURE 14. Z OUT vs f vs C L
FREQUENCY (Hz)
FIGURE 15. PSRR vs FREQUENCY
1s/DIV
FIGURE 16. V OUT NOISE, 0.1Hz TO 10Hz
Applications Information
FGA Technology
The ISL21070 series of voltage references use the floating gate
technology to create references with very low drift and supply
current. Essentially, the charge stored on a floating gate cell is set
precisely in manufacturing. The reference voltage output itself is a
buffered version of the floating gate voltage. The resulting reference
device has excellent characteristics which are unique in the industry:
very low temperature drift, high initial accuracy, and almost zero
supply current. Also, the reference voltage itself is not limited by
voltage bandgaps or zener settings, so a wide range of reference
voltages can be programmed (standard voltage settings are
provided, but customer-specific voltages are available).
The process used for these reference devices is a floating gate
CMOS process, and the amplifier circuitry uses CMOS transistors
for amplifier and output transistor circuitry. While providing
7
excellent accuracy, there are limitations in output noise level and
load regulation due to the MOS device characteristics. These
limitations are addressed with circuit techniques discussed in
other sections.
Handling and Board Mounting
FGA references provide excellent initial accuracy and low
temperature drift at the expense of very little power drain. There
are some precautions to take to insure this accuracy is not
compromised. Excessive heat during solder reflow can cause
excessive initial accuracy drift, so the recommended +260°C
max temperature profile should not be exceeded. Expect up to
1mV drift from the solder reflow process.
FGA references are susceptible to excessive X-radiation like that
used in PC board manufacturing. Initial accuracy can change
10mV or more under extreme radiation. If an assembled board
needs to be X-rayed, care should be taken to shield the FGA
reference device.
FN7599.2
July 1, 2011
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