参数资料
型号: ISL22317UFRTZ
厂商: Intersil
文件页数: 9/15页
文件大小: 0K
描述: IC POT DGTL 128TP LN LP 10-TDFN
产品培训模块: Solutions for Industrial Control Applications
标准包装: 100
系列: XDCP™
接片: 128
电阻(欧姆): 50k
电路数: 1
温度系数: 标准值 ±10 ppm/°C
存储器类型: 非易失
接口: I²C(设备位址)
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
供应商设备封装: 10-TDFN-EP(3x3)
包装: 管件
3
FN6912.1
April 15, 2010
Absolute Maximum Ratings
Thermal Information
Voltage at any Digital Interface Pin
with respect to GND. . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V
Voltage at any DCP Pin with respect to GND . . . . . . . . . .0V to VCC
IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
Latchup (Note 6) . . . . . . . . . . . . . . . . . . Class II, Level B at +125°C
ESD
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V
Thermal Resistance (Typical, Notes 4, 5)
θJA (°C/W) θJC(°C/W)
10 Lead TDFN . . . . . . . . . . . . . . . . .
44
3
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature Range (Extended Industrial). . . . . . . .-40°C to +125°C
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
VRH-VRL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1V to VCC - 0.3V
VRW-VRL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3V to VCC - 0.3V
Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15mW
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±3.0mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
5. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. Jedec Class II pulse conditions and failure criterion used. Level B exceptions is using a minimum negative pulse of -0.8V on the A1 pin.
Analog Specifications
Over recommended operating conditions unless otherwise stated.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 22)
TYP
(Note 7)
MAX
(Note 22)
UNIT
RTOTAL
RH to RL Resistance
W option
10
k
Ω
U option
50
k
Ω
T option
100
k
Ω
RH to RL Resistance Tolerance
U and T options
-3
±1
+3
%
W option
-4
±1
+4
%
End-to-End Temperature Coefficient
All options, match external reference TCr
TCref
±10
ppm/°C
VRH
DCP High Terminal Voltage
VRH to GND
VRL + 1
VCC - 0.3
V
VRL
DCP Low Terminal Voltage
VRL to GND
0
VCC - 1V
V
RW
Wiper Resistance
Precision On, RH - floating, VRL = 0V, force
IW current to wiper,
IW = (VCC - VRL)/RTOTAL
0
Ω
Precision Off, RH - floating, VRL = 0V, force
IW current to wiper,
IW = (VCC - VRL)/RTOTAL
70
Ω
RREF
External Reference Resistor
for W option, 0.5%
10
k
Ω
for U option, 0.5%
50
k
Ω
for T option, 0.5%
50
k
Ω
ILkgDCP
Leakage on DCP Pins
Voltage at pin from GND to VCC
0.1
0.5
A
VOLTAGE DIVIDER MODE (0V @ RL; VCC -0.3V @ RH; measured at RW, unloaded)
INL
(Note 12)
Integral Non-linearity
W, U or T option
VRL + 0.3V < VRW < VCC - 0.3V
-0.5
±0.1
0.5
LSB
(Note 8)
DNL
(Note 11)
Differential Non-linearity
W, U or T option
VRL + 0.3V < VRW < VCC - 0.3V
-0.5
±0.1
0.5
LSB
(Note 8)
ISL22317
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