参数资料
| 型号： | ISL22329UFU10Z |
| 厂商： | Intersil |
| 文件页数： | 9/13页 |
| 文件大小： | 0K |
| 描述： | IC POT DGTL 128TP LN LP 10-MSOP |
| 标准包装： | 50 |
| 系列： | XDCP™ |
| 接片： | 128 |
| 电阻（欧姆）： | 50k |
| 电路数： | 2 |
| 温度系数： | 标准值 ±80 ppm/°C |
| 存储器类型： | 非易失 |
| 接口： | I²C（设备位址） |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 管件 |
5
FN6330.2
September 4, 2009
SERIAL INTERFACE SPECS
VIL
A2, A1, A0, SDA, and SCL Input
Buffer Low Voltage
-0.3
0.3*VCC
V
VIH
A2, A1, A0, SDA, and SCL Input
Buffer High Voltage
0.7*VCC
VCC +
0.3
V
Hysteresis
SDA and SCL Input Buffer Hysteresis
0.05*
VCC
V
VOL
SDA Output Buffer LOW Voltage,
Sinking 4mA
00.4
V
Cpin
(Note 10)
A2, A1, A0, SDA, and SCL Pin
Capacitance
10
pF
fSCL
SCL Frequency
400
kHz
tsp
Pulse Width Suppression Time at
SDA and SCL Inputs
Any pulse narrower than the max spec is
suppressed
50
ns
tAA
SCL Falling Edge to SDA Output Data
Valid
SCL falling edge crossing 30% of VCC, until
SDA exits the 30% to 70% of VCC window
900
ns
tBUF
Time the Bus Must be Free Before the
Start of a New Transmission
SDA crossing 70% of VCC during a STOP
condition, to SDA crossing 70% of VCC
during the following START condition
1300
ns
tLOW
Clock LOW Time
Measured at the 30% of VCC crossing
1300
ns
tHIGH
Clock HIGH Time
Measured at the 70% of VCC crossing
600
ns
tSU:STA
START Condition Setup Time
SCL rising edge to SDA falling edge; both
crossing 70% of VCC
600
ns
tHD:STA
START Condition Hold Time
From SDA falling edge crossing 30% of VCC
to SCL falling edge crossing 70% of VCC
600
ns
tSU:DAT
Input Data Setup Time
From SDA exiting the 30% to 70% of VCC
window, to SCL rising edge crossing 30% of
VCC
100
ns
tHD:DAT
Input Data Hold Time
From SCL rising edge crossing 70% of VCC
to SDA entering the 30% to 70% of VCC
window
0ns
tSU:STO
STOP Condition Setup Time
From SCL rising edge crossing 70% of VCC,
to SDA rising edge crossing 30% of VCC
600
ns
tHD:STO
STOP Condition Hold Time for Read,
or Volatile Only Write
From SDA rising edge to SCL falling edge;
both crossing 70% of VCC
1300
ns
tDH
Output Data Hold Time
From SCL falling edge crossing 30% of VCC,
until SDA enters the 30% to 70% of VCC
window
0ns
tR
SDA and SCL Rise Time
From 30% to 70% of VCC
20 +
0.1*Cb
250
ns
tF
SDA and SCL Fall Time
From 70% to 30% of VCC
20 +
0.1*Cb
250
ns
Cb
Capacitive Loading of SDA or SCL
Total on-chip and off-chip
10
400
pF
Rpu
SDA and SCL Bus Pull-up Resistor
Off-chip
Maximum is determined by tR and tF
For Cb = 400pF, max is about 2k
Ω~2.5kΩ
For Cb = 40pF, max is about 15k
Ω~20kΩ
1k
Ω
Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 13)
TYP
(Note 3)
MAX
(Note 13)
UNIT
ISL22329
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| ISL22329UFU10Z-TK | 功能描述:IC POT DGTL 128TP LN LP 10-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:32 电阻（欧姆）:50k 电路数:1 温度系数:标准值 50 ppm/°C 存储器类型:易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 细型，TSOT-23-6 供应商设备封装:TSOT-23-6 包装:带卷 (TR) |
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