参数资料
型号: ISL22416UFRT10Z-TK
厂商: Intersil
文件页数: 8/14页
文件大小: 0K
描述: IC POT DGTL 128TP LN LP 10-TDFN
产品培训模块: Solutions for Industrial Control Applications
标准包装: 1,000
系列: XDCP™
接片: 128
电阻(欧姆): 50k
电路数: 1
温度系数: 标准值 ±80 ppm/°C
存储器类型: 非易失
接口: 4 线 SPI(芯片选择)
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
供应商设备封装: 10-TDFN-EP(3x3)
包装: 带卷 (TR)
3
FN6227.2
September 9, 2009
Absolute Maximum Ratings
Thermal Information
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage at any Digital Interface Pin
with Respect to GND . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Voltage at any DCP pin with Respect to GND . . . . . . . -0.3V to VCC
IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
Latchup (Note 1) . . . . . . . . . . . . . . . . . . Class II, Level B @ +125°C
ESD
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5kV
Charge Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV
Thermal Resistance (Typical)
θJA (°C/W) θJC(°C/W)
10 Lead MSOP (Note 2). . . . . . . . . . . .
162
N/A
10 Lead TDFN (Notes 2, 3) . . . . . . . . .
74
7
Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
Recommended Operating Conditions
Temperature Range (Extended Industrial). . . . . . . . -40°C to +125°C
Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mW
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.0mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: using a max positive pulse of 6.5V on the SHDN pin, and using
a max negative pulse of -1V for all pins.
2.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Analog Specifications
Over recommended operating conditions, unless otherwise stated. Parameters with MIN and/or MAX limits are
100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not
production tested.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
(Note 4)
MAX
UNIT
RTOTAL
RH to RL Resistance
W option
10
k
Ω
U option
50
k
Ω
RH to RL Resistance Tolerance
W and U option
-20
+20
%
End-to-End Temperature Coefficient
W option
±50
ppm/°C
(Note 18)
U option
±80
ppm/°C
(Note 18)
RW
Wiper Resistance
VCC = 3.3V, wiper current = VCC/RTOTAL
70
200
Ω
VRH, VRL
VRH and VRL Terminal Voltages
VRH and VRL to GND
0
VCC
V
CH/CL/CW
(Note 18)
Potentiometer Capacitance
10/10/25
pF
ILkgDCP
Leakage on DCP Pins
Voltage at pin from GND to VCC
0.1
1
A
VOLTAGE DIVIDER MODE (0V @ RL; VCC @ RH; measured at RW, unloaded)
INL
(Note 9)
Integral Non-linearity
Monotonic over all tap positions, W and U
option
-1
1
LSB
(Note 5)
DNL
(Note 8)
Differential Non-linearity
Monotonic over all tap positions, W and U
option
-0.5
0.5
LSB
(Note 5)
ZSerror
(Note 6)
Zero-scale Error
W option
0
1
5
LSB
(Note 5)
U option
0
0.5
2
FSerror
(Note 7)
Full-scale Error
W option
-5
-1
0
LSB
(Note 5)
U option
-2
-1
0
TCV
(Note 10, 18)
Ratiometric Temperature Coefficient
DCP register set to 40 hex for W and U
option
±4
ppm/°C
ISL22416
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