参数资料
| 型号： | ISL22429WFU10Z |
| 厂商： | Intersil |
| 文件页数： | 5/13页 |
| 文件大小： | 0K |
| 描述： | IC POT DGTL 128TP LN LP 10-MSOP |
| 标准包装： | 50 |
| 系列： | XDCP™ |
| 接片： | 128 |
| 电阻（欧姆）： | 10k |
| 电路数： | 2 |
| 温度系数： | 标准值 ±50 ppm/°C |
| 存储器类型： | 非易失 |
| 接口： | 4 线 SPI（芯片选择） |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 管件 |
13
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6332.2
May 28, 2009
ISL22429
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
and
to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
L
0.25
(0.010)
L1
R1
R
4X
θ
4X
θ
GAUGE
PLANE
SEATING
PLANE
E
E1
N
12
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008)
A
B C
SEATING
PLANE
0.20 (0.008)
C
0.10 (0.004)
C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008)
C
D
E1
CL
C
a
- H -
-A -
- B -
- H -
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.007
0.011
0.18
0.27
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
0.020 BSC
0.50 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N10
10
7
R
0.003
-
0.07
-
R1
0.003
-
0.07
-
5o
15o
5o
15o
-
α
0o
6o
0o
6o
-
Rev. 0 12/02
θ
相关PDF资料 |
PDF描述 |
|---|---|
| VI-21Z-MU-S | CONVERTER MOD DC/DC 2V 80W |
| IDT2309A-1DCGI8 | IC CLK BUFFER ZD STD DRV 16-SOIC |
| VI-2T3-MW-S | CONVERTER MOD DC/DC 24V 100W |
| IDT2309-1HPGG8 | IC CLK BUFFER ZD HI DRV 16-TSSOP |
| IDT2309-1HDCGI8 | IC CLK BUFFER ZD HI DRV 16-SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL22429WFU10Z-TK | 功能描述:IC POT DGTL 128TP LN LP 10-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:32 电阻（欧姆）:50k 电路数:1 温度系数:标准值 50 ppm/°C 存储器类型:易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 细型，TSOT-23-6 供应商设备封装:TSOT-23-6 包装:带卷 (TR) |
| ISL22444 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Quad Digitally Controlled Potentiometer XDCP |
| ISL22444TFR20Z | 功能描述:数字电位计 IC 273 TAP FL RNG IND QD SPI DCP 5X5 RoHS:否 制造商:Maxim Integrated 电阻:200 Ohms 温度系数:35 PPM / C 容差:25 % POT 数量:Dual 每 POT 分接头:256 弧刷存储器:Volatile 缓冲刷: 数字接口:Serial (3-Wire, SPI) 描述/功能:Dual Volatile Low Voltage Linear Taper Digital Potentiometer 工作电源电压:1.7 V to 5.5 V 电源电流:27 uA 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:TQFN-16 封装:Reel |
| ISL22444TFR20Z-TK | 功能描述:数字电位计 IC 276 TAP FL RNG IND QD SPI DCP 5X5 RoHS:否 制造商:Maxim Integrated 电阻:200 Ohms 温度系数:35 PPM / C 容差:25 % POT 数量:Dual 每 POT 分接头:256 弧刷存储器:Volatile 缓冲刷: 数字接口:Serial (3-Wire, SPI) 描述/功能:Dual Volatile Low Voltage Linear Taper Digital Potentiometer 工作电源电压:1.7 V to 5.5 V 电源电流:27 uA 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:TQFN-16 封装:Reel |
| ISL22444TFV20Z | 功能描述:数字电位计 IC 267 TAP FL RNG IND QD SPI DCP 20LD RoHS:否 制造商:Maxim Integrated 电阻:200 Ohms 温度系数:35 PPM / C 容差:25 % POT 数量:Dual 每 POT 分接头:256 弧刷存储器:Volatile 缓冲刷: 数字接口:Serial (3-Wire, SPI) 描述/功能:Dual Volatile Low Voltage Linear Taper Digital Potentiometer 工作电源电压:1.7 V to 5.5 V 电源电流:27 uA 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:TQFN-16 封装:Reel |
发布紧急采购，3分钟左右您将得到回复。