参数资料
型号: ISL22444WFV20Z-TK
厂商: Intersil
文件页数: 13/19页
文件大小: 0K
描述: IC POT DGTL 256TP LN LP 20-TSSOP
产品培训模块: Solutions for Industrial Control Applications
标准包装: 1,000
系列: XDCP™
接片: 256
电阻(欧姆): 10k
电路数: 4
温度系数: 标准值 ±85 ppm/°C
存储器类型: 非易失
接口: 4 线 SPI(芯片选择)
电源电压: 2.25 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 20-TSSOP
包装: 带卷 (TR)
3
FN6426.0
May 24, 2007
Pin Descriptions
TSSOP PIN
QFN PIN
SYMBOL
DESCRIPTION
1
19
RH3
“High” terminal of DCP3
2
20
RL3
“Low” terminal of DCP3
3
1
RW3
“Wiper” terminal of DCP3
4
2
NC
No connection
5
3
SCK
SPI interface clock input
6
4
SDO
Data Output of the SPI serial interface
7
5
GND
Device ground pin
8
6
RW2
“Wiper” terminal of DCP2
9
7
RL2
“Low” terminal of DCP2
10
8
RH2
“High” terminal of DCP2
11
9
RW1
“Wiper” terminal of DCP1
12
10
RL1
“Low” terminal of DCP1
13
11
RH1
“High” terminal of DCP1
14
12
CS
Chip Select active low input
15
13
SDI
Data Input of the SPI serial interface
16
14
VCC
Positive power supply pin
17
15
V-
Negative power supply pin
18
16
RH0
“High” terminal of DCP0
19
17
RL0
“Low” terminal of DCP0
20
18
RW0
“Wiper” terminal of DCP0
EPAD*
Exposed Die Pad internally connected to V-
* Note: PCB thermal land for QFN EPAD should be connected to V- plane or left floating. For more information refer to
http://www.intersil.com/data/tb/TB389.pdf
ISL22444
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