参数资料
型号: ISL22512WFB8Z-TK
厂商: Intersil
文件页数: 3/11页
文件大小: 0K
描述: IC POT DGTL PB 16TP LN LP 8-SOIC
标准包装: 1,000
系列: XDCP™
接片: 16
电阻(欧姆): 10k
电路数: 1
温度系数: 标准值 ±80 ppm/°C
存储器类型: 非易失
接口: 2 线按钮
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 带卷 (TR)
11
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6679.2
October 27, 2011
ISL22512
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
6
B
E
A
D
0.10 C
2X
2
0.10 M C A B
0.05 M C
(ND-1) X e
C
0.05 C
A
0.10 C
A1
SEATING PLANE
e
INDEX AREA
PIN #1 ID
3
5
(DATUM A)
(DATUM B)
N-1
1
N
NX L
NX b
2
1
N
TOP VIEW
BOTTOM VIEW
SIDE VIEW
NX (b)
SECTION "C-C"
FOR ODD TERMINAL/SIDE
e
CC
5
CL
TERMINAL TIP
(A1)
L
DETAIL “A” PIN 1 ID
L
0.05 MIN
0.10 MIN
0.10 C
2X
4xk
b
L10.2.1x1.6A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.45
0.50
0.55
-
A1
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
2.05
2.10
2.15
-
E
1.55
1.60
1.65
-
e
0.50 BSC
-
k0.20
--
-
L
0.35
0.40
0.45
-
N10
2
Nd
4
3
Ne
1
3
θ
0-
12
4
Rev. 3 6/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. Same as JEDEC MO-255UABD except:
No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm
"L" MAX dimension = 0.45 not 0.42mm.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
2.00
0.80
1.75
0.25
0.50
0.275
2.50
LAND PATTERN 10
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