参数资料
型号: ISL23328UFRUZ-TK
厂商: Intersil
文件页数: 11/20页
文件大小: 0K
描述: IC DGTL POT 2CH 50K 16UTQFN
标准包装: 1,000
系列: XDCP™
接片: 128
电阻(欧姆): 50k
电路数: 2
温度系数: 标准值 65 ppm/°C
存储器类型: 易失
接口: I²C(设备位址)
电源电压: 1.2 V ~ 5.5 V,1.7 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-UFQFN
供应商设备封装: 16-UTQFN(2.6x1.8)
包装: 带卷 (TR)
ISL23328
19
FN7902.0
August 19, 2011
Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
B
A
17
8
14
C
PLANE
SEATING
0.10 C
0.10
CBA
H
PIN #1
I.D. MARK
5.00 ±0.10
4.40 ±0.10
0.25 +0.05/-0.06
6.40
0.20 C B A
0.05
0°-8°
GAUGE
PLANE
SEE
0.90 +0.15/-0.10
0.60 ±0.15
0.09-0.20
5
2
3
1
3
1.00 REF
0.65
1.20 MAX
0.25
0.05 MIN
0.15 MAX
(1.45)
(5.65)
(0.65 TYP)
(0.35 TYP)
DETAIL "X"
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation AB-1.
NOTES:
END VIEW
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