参数资料
型号: ISL23348WFRZ-TK
厂商: Intersil
文件页数: 10/19页
文件大小: 0K
描述: IC DGTL POT 4CH 10K 20QFN
标准包装: 1,000
系列: XDCP™
接片: 128
电阻(欧姆): 10k
电路数: 4
温度系数: 标准值 125 ppm/°C
存储器类型: 易失
接口: I²C(设备位址)
电源电压: 1.2 V ~ 5.5 V,1.7 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 20-VFQFN 裸露焊盘
供应商设备封装: 20-QFN(3x4)
包装: 带卷 (TR)
ISL23348
18
FN7903.1
August 24, 2011
Package Outline Drawing
M20.173
20 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
SIDE VIEW
END VIEW
Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
Dimensions are measured at datum plane H.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
Dimension in ( ) are for reference only.
Conforms to JEDEC MO-153.
6.
3.
5.
4.
2.
1.
NOTES:
7.
0.09-0.20
SEE DETAIL "X"
(0.65 TYP)
(5.65)
(0.35 TYP)
0.90 +0.15/-0.10
0.60 ±0.15
0.15 MAX
0.05 MIN
PLANE
GAUGE
0°-8°
0.25
1.00 REF
(1.45)
20
0.20 C B A
2
1
3
9
B
1
3
10
A
PIN #1
I.D. MARK
6.50 ±0.10
6.40
4.40 ±0.10
0.65
0.10 C
SEATING
PLANE
0.25 +0.05/-0.06 5
C
H
-
0.05
1.20 MAX
0.10
C B A
M
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