参数资料
型号: ISL24003IRZ
厂商: Intersil
文件页数: 10/10页
文件大小: 0K
描述: IC BUFFER 18CH VCOM DRVR 44-QFN
标准包装: 260
应用: TFT-LCD 面板:伽玛缓冲器,VCOM 驱动器
输出类型: 满摆幅
电路数: 18
-3db带宽: 10MHz
转换速率: 9 V/µs
电流 - 电源: 11.5mA
电流 - 输出 / 通道: 130mA
电压 - 电源,单路/双路(±): 4.5 V ~ 16.5 V,±2.25 V ~ 8.25 V
安装类型: 表面贴装
封装/外壳: 44-VFQFN 裸露焊盘
供应商设备封装: 44-QFN-EP(7x7)
包装: 管件
9
FN6118.0
December 7, 2005
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible, and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the VS- pin is
connected to ground, one 0.1F ceramic capacitor should be
placed from the VS+ pin to ground. A 4.7F tantalum
capacitor should then be connected from the VS+ pin to
ground. One 4.7F capacitor may be used for multiple
devices. This same capacitor combination should be placed
at each supply pin to ground if split supplies are to be used.
Important Note: The metal plane used for heat sinking of
the device is electrically connected to the negative
supply potential (VS-). If VS- is tied to ground, the
thermal pad can be connected to ground. Otherwise, the
thermal pad must be isolated from any other power
planes.
ISL24003
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