参数资料
型号: ISL29043IROMZ-T7
厂商: Intersil
文件页数: 12/16页
文件大小: 0K
描述: IC SENSOR PROX/AMB LIGHT 10-ODFN
标准包装: 1,000
带接近传感器:
波长: 855nm
电源电压: 2.25 V ~ 3.63 V
输出类型: 数字 - I²C
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN
包装: 带卷 (TR)
ISL29043
FIGURE 7. EXAMPLE LIGHT BAFFLE DESIGN
250
Suggested PCB Footprint
It is important that users check the “Surface Mount Assembly
200
150
100
50
NO BAFFLE, 0.1mm FROM GLASS
AGAINST GLASS, NO BAFFLE
NO COVER GLASS
GLASS W/ BAFFLE
Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”
before starting ODFN product board mounting. However, this
device requires a special solder reflow profile as mentioned in
Figure 4 in TB489 (Surface Mount Guidelines for Optical
Co-packages ).
http://www.intersil.com/data/tb/TB489.pdf
0
0 10 20 30 40 50 60 70 80 90
DISTANCE (mm)
FIGURE 8. PROXIMITY COMPARISON WITHOUT LIGHT BAFFLE
(IRDR = 110mA)
Typical Circuit
A typical application for the ISL29043 is shown in Figure 9. The
ISL29043’s I 2 C address is internally hardwired as 0b100010<x>,
with x representing the logic state of input I 2 C address pin
ADDR0. The device can be tied onto a system’s I 2 C bus together
with other I 2 C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The plastic ODFN
package requires a custom reflow soldering profile pursuant to
Figure 4 in TB489 ( Surface Mount Assembly Guidelines for
Optical Dual Flat No Lead (ODFN) Co-Packages ).
12
Layout Considerations
The ISL29043 is relatively insensitive to layout. Like other I 2 C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I 2 C traces as far as possible from all
sources of noise. 0.1μF and 1μF power supply decoupling
capacitors need to be placed close to the device.
FN7935.0
February 9, 2012
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