参数资料
| 型号： | ISL31470EIBZ |
| 厂商： | Intersil |
| 文件页数： | 21/21页 |
| 文件大小： | 0K |
| 描述： | IC TXRX RS485 FAULT PROT 14SOIC |
| 标准包装： | 1,000 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 1/1 |
| 规程： | RS422，RS485 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SOICN |
| 包装： | 管件 |
ISL31470E, ISL31472E, ISL31475E, ISL31478E
9
FN7639.0
June 17, 2010
Receiver Skew |tPLH - tPHL|tSKD
(Figure 5)
Full
-
4
10
ns
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC
Full
-
50
ns
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND
Full
-
50
ns
Receiver Disable from Output
Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 6)
Full
-
50
ns
Receiver Disable from Output
High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 6)
Full
-
50
ns
Time to Shutdown
tSHDN
(Note 13)
Full
60
160
600
ns
Receiver Enable from
Shutdown to Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND
Full
-
2000
ns
Receiver Enable from
Shutdown to Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC
Full
-
2000
ns
NOTES:
8. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground
unless otherwise specified.
9. Supply current specification is valid for loaded drivers when DE = 0V.
10. Applies to peak current. See “Typical Performance Curves” beginning on page 14 for more information.
11. Keep RE = 0 to prevent the device from entering SHDN.
12. The RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.
13. Transceivers are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts
are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered
14. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
15. Set the RE signal high time >600ns to ensure that the device enters SHDN.
16. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested.
17. Tested according to TIA/EIA-485-A, Section 4.2.6 (±80V for 15μs at a 1% duty cycle).
18. See “Caution” statement below the “Recommended Operating Conditions” section on page 5.
Test Circuits and Waveforms
FIGURE 1A. VOD AND VOC
FIGURE 1B. VOD AND VOC WITH COMMON MODE LOAD
FIGURE 1. DC DRIVER TEST CIRCUITS
Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,
TA = +25°C (Note 8). Boldface limits apply over the operating temperature range,
-40°C to +85°C. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 16) TYP
MAX
(Note 16) UNITS
D
DE
DI
VCC
VOD
VOC
RL/2
Z
Y
D
DE
DI
VOD
375Ω
Z
Y
VCM
VCC
RL/2
VOC
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL31470EIBZ-T | 功能描述:IC TXRX RS485 FAULT PROT 14SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL31470EIBZ-T7A | 功能描述:RS-422/RS-485 接口 IC 14LD OVP -40+85 5V FD+/-15V CMR 250KBP RoHS:否 制造商:Maxim Integrated 数据速率:1136 Kbps 工作电源电压:3 V to 5.5 V 电源电流:5.9 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-28 封装:Tube |
| ISL31472E | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Fault Protected, Extended Common Mode Range, RS-485/RS-422 Transceivers |
| ISL31472EIBZ | 功能描述:IC TXRX RS485 FAULT PROT 8SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL31472EIBZ-T | 功能描述:IC TXRX RS485 FAULT PROT 8SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
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