参数资料
| 型号： | ISL3158EIBZ-T |
| 厂商： | Intersil |
| 文件页数： | 10/22页 |
| 文件大小： | 0K |
| 描述： | TXRX ESD 5V RS-485/422 8-SOIC |
| 标准包装： | 2,500 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 1/1 |
| 规程： | RS422，RS485 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 带卷 (TR) |
18
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
and
to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
L
0.25
(0.010)
L1
R1
R
4X
θ
4X
θ
GAUGE
PLANE
SEATING
PLANE
E
E1
N
12
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008)
A B C
SEATING
PLANE
0.20 (0.008)
C
0.10 (0.004)
C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008)
C D
E1
CL
C
a
- H -
-A -
- B -
- H -
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
0.026 BSC
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N8
8
7
R
0.003
-
0.07
-
R1
0.003
-
0.07
-
05o
15o
5o
15o
-
α
0o
6o
0o
6o
-
Rev. 2 01/03
相关PDF资料 |
PDF描述 |
|---|---|
| MS27497T14F35SA | CONN RCPT 37POS WALL MNT W/SCKT |
| ISL3156EIUZ-T | TXRX ESD 5V RS-485/422 10-MSOP |
| MAX1231BCEG+T | IC ADC 12BIT 300KSPS 24-QSOP |
| MS3100A22-22P | CONN RCPT 4POS WALL MNT W/PINS |
| VI-B6D-IV-F2 | CONVERTER MOD DC/DC 85V 150W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL3158EIBZ-T7A | 功能描述:RS-422/RS-485 接口 IC 8LD -40+85 3V RS-485 HIVOD TRAN 1/ RoHS:否 制造商:Maxim Integrated 数据速率:1136 Kbps 工作电源电压:3 V to 5.5 V 电源电流:5.9 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-28 封装:Tube |
| ISL3158EIUZ | 功能描述:TXRX ESD 5V RS-485/422 8-MSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL3158EIUZ-T | 功能描述:TXRX ESD 5V RS-485/422 8-MSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:带卷 (TR) |
| ISL3158EIUZ-T7A | 功能描述:RS-422/RS-485 接口 IC IEC-6100 RS-485 HIVO TRANS 1/2 DUP 3V 10M RoHS:否 制造商:Maxim Integrated 数据速率:1136 Kbps 工作电源电压:3 V to 5.5 V 电源电流:5.9 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-28 封装:Tube |
| ISL3159E | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:【15kV ESD Protected, +125∑C, 40Mbps, 5V, PROFIBUS㈢, Full Fail-safe, RS-485/RS-422 Transceivers |
发布紧急采购，3分钟左右您将得到回复。