- 您现在的位置：买卖IC网 > PDF目录10693 > ISL3171EIUZ (Intersil)TXRX ESD 3.3V RS-485/422 8-MSOP PDF资料下载
参数资料
| 型号： | ISL3171EIUZ |
| 厂商： | Intersil |
| 文件页数： | 9/19页 |
| 文件大小： | 0K |
| 描述： | TXRX ESD 3.3V RS-485/422 8-MSOP |
| 产品培训模块： | Solutions for Industrial Control Applications |
| 标准包装： | 98 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 1/1 |
| 规程： | RS422，RS485 |
| 电源电压： | 3 V ~ 3.6 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 管件 |
| 产品目录页面： | 1240 (CN2011-ZH PDF) |
17
FN6307.5
June 8, 2012
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E,ISL3176E, ISL3177E, ISL3178E
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
TOP VIEW
INDEX
AREA
12
3
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
8°
0°
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
4
5
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0.023)
相关PDF资料 |
PDF描述 |
|---|---|
| LT1713CMS8#TR | IC COMP R-R I/O SINGLE LP 8MSOP |
| VE-JW2-MY-F2 | CONVERTER MOD DC/DC 15V 50W |
| ISL3156EIBZ | TXRX ESD 5V RS-485/422 14-SOIC |
| LT1671CMS8#TRPBF | IC COMPARATOR 60NS LOW PWR 8MSOP |
| ISL3172EIBZ | TXRX ESD 3.3V RS-485/422 8-SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL3171EIUZ-T | 功能描述:TXRX ESD 3.3V RS-485/422 8-MSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:带卷 (TR) |
| ISL3172E | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:【15kV ESD Protected, 3.3V, Full Fail-safe, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers |
| ISL3172EIBZ | 功能描述:RS-422/RS-485 接口 IC 8LD -40+85 3V RS-485 1/2 DUP 115 RoHS:否 制造商:Maxim Integrated 数据速率:1136 Kbps 工作电源电压:3 V to 5.5 V 电源电流:5.9 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-28 封装:Tube |
| ISL3172EIBZ | 制造商:Intersil Corporation 功能描述:TRANSCEIVER 3.3V HALF DUP SOIC8 制造商:Intersil Corporation 功能描述:TRANSCEIVER, 3.3V, HALF DUP, SOIC8 |
| ISL3172EIBZ-T | 功能描述:TXRX ESD 3.3V RS-485/422 8-SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:带卷 (TR) |
发布紧急采购，3分钟左右您将得到回复。