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参数资料
| 型号： | ISL33003MSOPEVAL1Z |
| 厂商： | Intersil |
| 文件页数： | 11/18页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD ISL33003 8MSOP |
| 标准包装： | 1 |
| 主要目的： | 电源管理，热交换控制器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ISL33003IUZ |
| 主要属性： | 2 通道总线缓冲器 |
| 次要属性： | I²C 接口 |
| 已供物品： | 板 |
| 相关产品： | ISL33003IUZ-T-ND - IC BUS BUFF HOTSWAP 2WR 8MSOP ISL33003IRTZ-T-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN ISL33003IRTZ-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN ISL33003IRT2Z-T-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN ISL33003IRT2Z-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN ISL33003IUZ-ND - IC BUS BUFF HOTSWAP 2WR 8MSOP |
ISL33001, ISL33002, ISL33003
2
FN7560.5
December 19, 2013
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
ISL33001IRTZ
3001
-40 to +85
8 Ld TDFN (0.65mm Pitch)
L8.3x3A
ISL33001IRT2Z
01R2
-40 to +85
8 Ld TDFN (0.5mm Pitch)
L8.3x3H
ISL33001IBZ
33001 IBZ
-40 to +85
8 Ld SOIC
M8.15
ISL33001IUZ
33001
-40 to +85
8 Ld MSOP
M8.118
ISL33002IRTZ
3002
-40 to +85
8 Ld TDFN (0.65mm Pitch)
L8.3x3A
ISL33002IRT2Z
02R2
-40 to +85
8 Ld TDFN (0.5mm Pitch)
L8.3x3H
ISL33002IUZ
33002
-40 to +85
8 Ld MSOP
M8.118
ISL33003IRTZ
3003
-40 to +85
8 Ld TDFN (0.65mm Pitch)
L8.3x3A
ISL33003IRT2Z
03R2
-40 to +85
8 Ld TDFN (0.5mm Pitch)
L8.3x3H
ISL33003IUZ
33003
-40 to +85
8 Ld MSOP
M8.118
ISL33001MSOPEVAL1Z
ISL33001 Evaluation Board
ISL33002MSOPEVAL1Z
ISL33002 Evaluation Board
ISL33003MSOPEVAL1Z
ISL33003 Evaluation Board
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL33001, ISL33002, ISL33003. For more information on MSL please
see techbrief TB363.
Pin Configurations
ISL33001
(8 LD TDFN)
TOP VIEW
ISL33001
(8 LD SOIC, MSOP)
TOP VIEW
ISL33002
(8 LD TDFN)
TOP VIEW
ISL33002
(8 LD MSOP)
TOP VIEW
3
2
1
SCL_IN
GND 4
6
7
8
5
EN
VCC1
READY
SCL_OUT
SDA_IN
SDA_OUT
PAD
6
7
8
5
3
2
1
4
GND
VCC1
EN
READY
SDA_IN
SDA_OUT
SCL_IN
SCL_OUT
3
2
1
GND 4
6
7
8
5
VCC1
ACC
PAD
VCC2
SCL_IN
SCL_OUT
SDA_IN
SDA_OUT
6
7
8
5
3
2
1
4
VCC2
GND
VCC1
ACC
SDA_IN
SDA_OUT
SCL_IN
SCL_OUT
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL3330 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:3.3V, ?±15kV ESD Protected, Dual Protocol RS-232/RS-485 Transceivers |
| ISL3330IAZ | 功能描述:RS-422/RS-485 接口 IC SINGLE 3 3V MULTIPRO TRANSC -40C RoHS:否 制造商:Maxim Integrated 数据速率:1136 Kbps 工作电源电压:3 V to 5.5 V 电源电流:5.9 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-28 封装:Tube |
| ISL3330IAZ-T | 功能描述:IC TXRX 3.3V RS232/485 20-SSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL3330IAZ-T7A | 功能描述:IC TXRX RS232/485 DUAL 20SSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL3331 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Worlda??s Most Power-Effi cient |
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