参数资料
型号: ISL3330IAZ
厂商: Intersil
文件页数: 23/25页
文件大小: 0K
描述: IC TXRX 3.3V RS232/485 20-SSOP
产品培训模块: Solutions for Industrial Control Applications
标准包装: 66
类型: 收发器
驱动器/接收器数: 2/2
规程: RS232,RS422,RS485
电源电压: 3.15 V ~ 3.45 V
安装类型: 表面贴装
封装/外壳: 20-SSOP(0.209",5.30mm 宽)
供应商设备封装: 20-SSOP
包装: 管件
7
FN6361.0
May 20, 2008
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
VL (QFN Only) . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V
Input Voltages
All Except A,B. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Input/Output Voltages
A, B (Any Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V to +25V
Y, Z (Any Mode, Note 5) . . . . . . . . . . . . . . . . . . . -12.5V to +12.5V
RA, RB (Non-QFN Package) . . . . . . . . . . . -0.5V to (VCC + 0.5V)
RA, RB (QFN Package) . . . . . . . . . . . . . . . . -0.5V to (VL + 0.5V)
Output Short Circuit Duration
Y, Z, RA, RB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical)
θ
JA (°C/W)
θ
JC (°C/W)
20 Ld SSOP Package (Note 6) . . . . . .
55
N/A
40 Ld QFN Package (Notes 7, 8). . . . .
31
2.5
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . see link below
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
5. One output at a time, IOUT ≤ 100mA for ≤ 10 minutes.
6.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
7.
θ
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
8. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Test Conditions: VCC = 3.15V to 3.45V, C1 to C4 = 0.1F, VL = VCC (for QFN only), Unless Otherwise Specified.
Typicals are at VCC = 3.3V, TA = +25°C (Note 9)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 15)
TYP
MAX
(Note 15) UNITS
DC CHARACTERISTICS - RS-485 DRIVER (485/232 = VCC)
Driver Differential VOUT (no load)
VOD1
Full
-
VCC
V
Driver Differential VOUT (with load)
VOD2
R = 50
Ω (RS-422) (Figure 1)
Full
2
2.3
-
V
R = 27
Ω (RS-485) (Figure 1)
Full
1.5
2
5
V
VOD3
RD = 60Ω, R = 375Ω, VCM = -7V to 12V
(Figure 1)
Full
1.5
-
5
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔV
OD
R = 27
Ω or 50Ω (Figure 1)
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
R = 27
Ω or 50Ω (Figure 1)
Full
-
3.0
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC
R = 27
Ω or 50Ω (Figure 1)
Full
-
0.01
0.2
V
Driver Short-Circuit Current,
VOUT = High or Low
IOS
-7V
≤ (VY or VZ) ≤ 12V (Note 11)
Full
35
-
250
mA
Driver Three-State Output Leakage
Current (Y, Z)
IOZ
Outputs Disabled,
VCC = 0V or 3.45V
VOUT = 12V
Full
-
150
A
VOUT = -7V
Full
-150
-
A
DC CHARACTERISTICS - RS-232 DRIVER (485/232 = 0V)
Driver Output Voltage Swing
VO
All TOUTS Loaded with 3kΩ to Ground
Full
±5.0
-
V
Driver Output Short-Circuit Current
IOS
VOUT = 0V
Full
-60
-
60
mA
DC CHARACTERISTICS - LOGIC PINS (i.e., DRIVER AND CONTROL INPUT PINS)
Input High Voltage
VIH1
VL = VCC if QFN
Full
2.2
-
V
VIH2
2.7V
≤ VL < 3.0V (QFN Only)
Full
2
-
V
VIH3
2.3V
≤ VL < 2.7V (QFN Only)
Full
1.6
-
V
VIH4
1.6V
≤ VL < 2.3V (QFN Only)
Full
0.7*VL
-V
VIH5
1.2V
≤ VL < 1.6V (QFN Only)
25
-
0.7*VL
-V
ISL3330, ISL3331
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