参数资料
型号: ISL34341KIT1Z
厂商: Intersil
文件页数: 5/11页
文件大小: 0K
描述: EVAL KIT FOR ISL34341
产品培训模块: Solutions for Industrial Control Applications
标准包装: 1
系列: *
3
FN6827.1
October 8, 2010
Absolute Maximum Ratings
Thermal Information
Supply Voltage
VDD_P to GND_P, VDD_TX to GND_TX,
VDD_IO to GND_IO . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.6V
VDD_CDR to GND_CDR, VDD_CR to GND_CR . . -0.5V to 2.5V
Between any pair of GND_P, GND_TX,
GND_IO, GND_CDR, GND_CR . . . . . . . . . . . . . -0.1V to 0.1V
3.3V Tolerant LVTTL/LVCMOS
Input Voltage . . . . . . . . . . . . . . . . . . . . . .-0.3V to VDD_IO + 0.3V
Differential Input Voltage . . . . . . . . . . . . . . .-0.3V to VDD_IO + 0.3V
Differential Output Current . . . . . . . . . . . . . .Short Circuit Protected
LVTTL/LVCMOS Outputs . . . . . . . . . . . . . . . .Short Circuit Protected
ESD Rating
Human Body Model
All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4kV
SERIOP/N (all VDD Connected, all GND Connected) . . . . .8kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200V
Thermal Resistance (Typical, Notes 1, 2)
θJA
θJC (°C/W)
EPTQFP. . . . . . . . . . . . . . . . . . . . . . . .
40
12
Maximum Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . 327mW
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
2. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Unless otherwise indicated, all data is for: VDD_CDR = VDD_CR = 1.8V, VDD_IO = 3.3V,
VDD_TX = VDD_P = VDD_AN = 3.3V, TA = +25°C, Ref_Res = 3.16kΩ, High-speed AC-coupling
capacitor = 27nF.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY VOLTAGE
VDD_CDR, VDD_CR
1.7
1.8
1.9
V
VDD_TX, VDD_P, VDD_AN, VDD_IO
3.0
3.3
3.6
V
SERIALIZER POWER SUPPLY CURRENTS
Analog TX Supply Current
IDDTX
VIDEO_TX = 1
PCLK_IN = 40MHz
17
mA
Analog CDR Supply Current
IDDCDR
57
mA
Digital I/O Supply Current
IDDIO
12
mA
Digital Supply Current
IDDCR
20
mA
PLL/VCO Supply Current
IDDP
17
mA
Analog Bias Supply Current
IDDAN
5.5
mA
Total 1.8V Supply Current
77
90
mA
Total 3.3V Supply Current
40
46
mA
DESERIALIZER POWER SUPPLY CURRENTS
Analog TX Supply Current
IDDTX
VIDEO_TX = 0
REF_CLK = 40MHz
24
mA
Analog CDR Supply Current
IDDCDR
45
mA
Digital I/O Supply Current
IDDIO
17
25
mA
Digital Supply Current
IDDCR
32
mA
PLL/VCO Supply Current
IDDP
17
mA
Analog Bias Supply Current
IDDAN
5.4
mA
Total 1.8V Supply Current
77
90
mA
Total 3.3V Supply Current
64
80
mA
ISL34341
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