参数资料
| 型号： | ISL54004IRTZ-T |
| 厂商： | Intersil |
| 文件页数： | 12/13页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO PWR 1.23W AB 20TQFN |
| 标准包装： | 6,000 |
| 类型： | AB 类 |
| 输出类型： | 1-通道（单声道），带立体声耳机 |
| 在某负载时最大输出功率 x 通道数量： | 1.23W x 1 @ 8 欧姆; 215mW x 2 @ 16 欧姆 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 特点： | 消除爆音，关机，热保护 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 20-TQFN（4x4） |
| 封装/外壳： | 20-WFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
8
FN6513.2
October 30, 2007
Low Power Shutdown
With a logic “1” at the SD control pin the device enters the
low power shutdown state. When in shutdown the BTL and
headphone amplifiers go into an high impedance state and
IDD supply current is reduced to 26A (typ).
In shutdown mode before the amplifiers enter the high
impedance/low current drive state, the bias voltage of VDD/2
remains connected at the output of the amplifiers through a
100k
Ω resistor.
This resistor is not present during active operation of the
drivers but gets switched in when the SD pin goes high. It
gets removed when the SD pin goes low.
Leaving the DC bias voltage connected through a 100k
Ω
resistor while going into and out of shutdown reduces the
transient at the speakers to a small level preventing clicking
or popping in the speakers.
Note: When the SD pin is High it overrides all other logic
pins.
QFN Die Attach Paddle Considerations
The QFN package features an exposed thermal pad on its
underside. This pad lowers the package’s thermal resistance
by providing a direct heat conduction path from the die to the
PCB. Connect the exposed thermal pad to GND by using a
large copper pad and multiple vias to the GND plane. The
vias should be plugged and tented with plating and solder
mask to ensure good thermal conductivity.
Best thermal performance is achieved with the largest
practical copper ground plane area.
PCB Layout Considerations and Power
Supply Bypassing
To maintain the highest load dissipation and widest output
voltage swing the power supply PCB traces and the traces
that connect the output of the drivers to the speaker loads
should be made as wide as possible to minimize losses due
to parasitic trace resistance.
Proper supply bypassing is necessary for high power supply
rejection and low noise performance. A filter network
consisting of a 10F capacitor in parallel with a 0.1F
capacitor is recommended at the voltage regulator that is
providing the power to the ISL54004 IC.
Local bypass capacitors of 0.1F should be put at each VDD
pin of the ISL54004 device. They should be located as close
as possible to the pin, keeping the length of leads and traces
as short as possible.
A 1F capacitor from the REF pin (pin 10) to GND is needed
for optimum PSRR and internal bias voltage stability.
Typical Performance Curves TA = +25°C, Unless Otherwise Specified
FIGURE 1. THD+N vs FREQUENCY
FIGURE 2. THD+N vs FREQUENCY
THD+N
(
%
)
FREQUENCY (Hz)
0.1
1.0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
20
20k
50
100
200
500
1k
2k
5k
10k
VDD = 5V
BTL
RL = 8Ω
PO = 800mW
THD+
N
(%)
FREQUENCY (Hz)
0.1
1.0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
20
20k
50
100
200
500
1k
2k
5k
10k
VDD = 3.6V
BTL
RL = 8Ω
PO = 200mW
ISL54004
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL54005 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Integrated Audio Amplifier Systems |
| ISL54005IRTZ | 功能描述:IC AMP AUDIO PWR 1.23W AB 20TQFN RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:D 类 输出类型:1-通道（单声道），带立体声耳机 在某负载时最大输出功率 x 通道数量:930mW x 1 @ 8 欧姆; 40mW x 2 @ 16 欧姆 电源电压:2.7 V ~ 5.5 V 特点:消除爆音，差分输入，I²C，静音，关闭，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) 其它名称:MAX97000EWA+T-ND |
| ISL54005IRTZ-T | 功能描述:IC AMP AUDIO PWR 1.23W AB 20TQFN RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:D 类 输出类型:1-通道（单声道），带立体声耳机 在某负载时最大输出功率 x 通道数量:930mW x 1 @ 8 欧姆; 40mW x 2 @ 16 欧姆 电源电压:2.7 V ~ 5.5 V 特点:消除爆音，差分输入，I²C，静音，关闭，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) 其它名称:MAX97000EWA+T-ND |
| ISL54006 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Integrated Audio Amplifier Systems |
| ISL54006IRTZ | 功能描述:IC AMP AUDIO PWR 1.23W AB 20TQFN RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:D 类 输出类型:1-通道（单声道），带立体声耳机 在某负载时最大输出功率 x 通道数量:930mW x 1 @ 8 欧姆; 40mW x 2 @ 16 欧姆 电源电压:2.7 V ~ 5.5 V 特点:消除爆音，差分输入，I²C，静音，关闭，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) 其它名称:MAX97000EWA+T-ND |
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