参数资料
型号: ISL54006IRTZ
厂商: Intersil
文件页数: 2/15页
文件大小: 0K
描述: IC AMP AUDIO PWR 1.23W AB 20TQFN
标准包装: 75
类型: AB 类
输出类型: 1-通道(单声道),带立体声耳机
在某负载时最大输出功率 x 通道数量: 1.23W x 1 @ 8 欧姆; 215mW x 2 @ 16 欧姆
电源电压: 2.7 V ~ 5.5 V
特点: 消除爆音,输入多路复用器,关机,热保护
安装类型: 表面贴装
供应商设备封装: 20-TQFN(4x4)
封装/外壳: 20-WFQFN 裸露焊盘
包装: 管件
10
FN6514.2
October 30, 2007
A microprocessor or a switch can be used to drive the HP
pin rather than using the headphone jack contact pin.
Note: With a logic “1” at the HO pin, the BTL driver remains
active regardless of the voltage level at the HD pin. This
allows a headphone to be plugged into the headphone jack
without activating the HP drivers. Music will continue to play
through the internal 8
Ω speaker rather than the headphones.
Low Power Shutdown
With a logic “1” at the SD control pin the device enters the
low power shutdown state. When in shutdown the BTL and
headphone amplifiers go into an high impedance state and
IDD supply current is reduced to 26A (typ).
In shutdown mode before the amplifiers enter the high
impedance/low current drive state, the bias voltage of VDD/2
remains connected at the output of the amplifiers through a
100k
Ω resistor.
This resistor is not present during active operation of the
drivers but gets switched in when the SD pin goes high. It
gets removed when the SD pin goes low.
Leaving the DC bias voltage connected through a 100k
Ω
resistor while going into and out of shutdown reduces the
transient at the speakers to a small level preventing clicking
or popping in the speakers.
Note: When the SD pin is High it over-rides all other logic
pins.
QFN Thermal Pad Considerations
The QFN package features an exposed thermal pad on its
underside. This pad lowers the package’s thermal resistance
by providing a direct heat conduction path from the die to the
PCB. Connect the exposed thermal pad to GND by using a
large copper pad and multiple vias to the GND plane. The
vias should be plugged and tented with plating and solder
mask to ensure good thermal conductivity.
Best thermal performance is achieved with the largest
practical copper ground plane area.
PCB Layout Considersations and Power
Supply Bypassing
To maintain the highest load dissipation and widest output
voltage swing, the power supply PCB traces and the traces
that connect the output of the drivers to the speaker loads
should be made as wide as possible to minimize losses due
to parasitic trace resistance.
Proper supply bypassing is necessary for high power supply
rejection and low noise performance. A filter network
consisting of a 10F capacitor in parallel with a 0.1F
capacitor is recommended at the voltage regulator that is
providing the power to the ISL54003, ISL54004, ISL54006
IC.
Local bypass capacitors of 0.1F should be put at each VDD
pin of the ISL54003, ISL54004, ISL54006 devices. They
should be located as close as possible to the pin, keeping
the length of leads and traces as short as possible.
A 1F capacitor from the REF pin (pin 10) to ground is
needed for optimum PSRR and internal bias voltage stability.
Typical Performance Curves
TA = +25°C, Unless Otherwise Specified.
FIGURE 1. THD+N vs FREQUENCY
FIGURE 2. THD+N vs FREQUENCY
THD+N
(
%
)
FREQUENCY (Hz)
0.1
1.0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
20
20k
50
100
200
500
1k
2k
5k
10k
VDD = 5V
BTL
RL = 8Ω
PO = 800mW
THD+N
(%)
FREQUENCY (Hz)
0.1
1.0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
20
20k
50
100
200
500
1k
2k
5k
10k
VDD = 3.6V
BTL
RL = 8Ω
PO = 200mW
ISL54003, ISL54005, ISL54006
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