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参数资料
| 型号： | ISL55100AEVAL3Z |
| 厂商： | Intersil |
| 文件页数： | 6/14页 |
| 文件大小： | 0K |
| 描述： | EVALUATION BOARD FOR ISL55100A |
| 标准包装： | 1 |
| 主要目的： | * |
| 嵌入式： | * |
| 已用 IC / 零件： | * |
| 主要属性： | * |
| 次要属性： | * |
| 已供物品： | * |
14
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FN7486.2
November 24, 2008
ISL55100A
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L72.10x10
72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.80
0.90
1.00
-
A1
-
0.02
0.05
-
A2
-
0.65
1.00
9
A3
0.20 REF
9
b
0.18
0.25
0.30
5, 8
D
10.00 BSC
-
D1
9.75 BSC
9
D2
5.85
6.00
6.15
7, 8
E
10.00 BSC
-
E1
9.75 BSC
9
E2
5.85
6.00
6.15
7, 8
e
0.50 BSC
-
k0.20
-
L
0.30
0.40
0.50
8, 10
N72
2
Nd
18
3
Ne
18
3
P-
-
0.60
9
θ
--
12
9
Rev. 1 11/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Compliant to JEDEC MO-220VNND-3 except for the "L" min
dimension.
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