参数资料
| 型号： | ISL5757IBZ |
| 厂商： | Intersil |
| 文件页数： | 1/13页 |
| 文件大小： | 0K |
| 描述： | IC DAC 10BIT 260MHZ 28-SOIC |
| 标准包装： | 26 |
| 位数： | 10 |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 电压电源： | 模拟和数字 |
| 功率耗散（最大）： | 157mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 28-SOIC W |
| 包装： | 管件 |
| 输出数目和类型： | 4 电流，单极 |
| 采样率（每秒）： | 260M |
1
FN6078.1
ISL5757
10-bit, +3.3V, 260+MSPS, High Speed D/A
Converter
The ISL5757 is a 10-bit, 260+MSPS (Mega Samples Per
Second), CMOS, high speed, low power, D/A (digital to
analog) converter, designed specifically for use in high
performance communication systems such as base
transceiver stations utilizing 2.5G or 3G cellular protocols.
This device complements the ISL5x57 family of high speed
converters, which include 10, 12, and 14-bit devices.
Features
Low Power . . . . . 103mW with 20mA Output at 130MSPS
Adjustable Full Scale Output Current. . . . . 2mA to 20mA
+3.3V Power Supply
3V LVCMOS Compatible Inputs
Excellent Spurious Free Dynamic Range
(71dBc to Nyquist, fS = 130MSPS, fOUT = 10MHz)
UMTS Adjacent Channel Power = 65dB at 19.2MHz
EDGE/GSM SFDR = 83dBc at 11MHz in 20MHz Window
Pin compatible, 3.3V, Lower Power Replacement For The
AD9750 and HI5760
Pb-Free Available (RoHS Compliant)
Applications
Cellular Infrastructure - Single or Multi-Carrier: IS-136,
IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA
BWA Infrastructure
Medical/Test Instrumentation
Wireless Communication Systems
High Resolution Imaging Systems
Arbitrary Waveform Generators
Pinout
ISL5757
TOP VIEW
Ordering Information
PART
NUMBER
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
CLOCK
SPEED
ISL5757IB
-40 to 85 28 Ld SOIC
M28.3
260MHz
ISL5757IBZ
(See Note)
-40 to 85 28 Ld SOIC
(Pb-free)
M28.3
260MHz
ISL5757IA
-40 to 85 28 Ld TSSOP
M28.173 260MHz
ISL5757IAZ
(See Note)
-40 to 85 28 Ld TSSOP
(Pb-free)
M28.173 260MHz
ISL5757EVAL1
25
SOIC Evaluation Platform 260MHz
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with
both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J STD-020C.
28
27
26
25
24
23
22
21
20
19
18
17
16
15
D9 (MSB)
D8
D7
D6
D5
D4
D3
D2
D1
D0 (LSB)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CLK
DCOM
NC
AVDD
COMP
IOUTB
NC
FSADJ
REFIO
REFLO
SLEEP
DVDD
IOUTA
ACOM
DCOM
Data Sheet
November 12, 2004
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
相关PDF资料 |
PDF描述 |
|---|---|
| ISL5761/2IBZ | CONV D/A 10BIT HS LP 28-SOIC |
| ISL5827INZ | IC DAC DUAL 12BIT 3.3V 48-LQFP |
| ISL5857IAZ | IC DAC 12-BIT 260MSPS 28-TSSOP |
| ISL5861/2IBZ | IC DAC 12BIT 210MSPS 28-SOIC |
| ISL5927INZ | IC DAC 14BIT CMOS DUAL 48LQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL5761 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:10-bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter |
| ISL5761/21A | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| ISL5761/2IA | 功能描述:IC DAC 10BIT 130MSPS 28-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| ISL5761/2IAZ | 功能描述:CONV D/A 10BIT HS LP 28-TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 设置时间:1µs 位数:8 数据接口:串行 转换器数目:8 电压电源:双 ± 功率耗散（最大）:941mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC W 包装:带卷 (TR) 输出数目和类型:8 电压，单极 采样率（每秒）:* |
| ISL5761/2IB | 功能描述:IC DAC 10-BIT 210MSPS 28-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
发布紧急采购，3分钟左右您将得到回复。