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参数资料
| 型号： | ISL59442IBZ-T7 |
| 厂商： | INTERSIL CORP |
| 元件分类： | 运动控制电子 |
| 英文描述： | 1GHz, 4 x 1 Multiplexing Amplifier |
| 中文描述： | 4-CHANNEL, VIDEO MULTIPLEXER, PDSO14 |
| 封装： | ROHS COMPLIANT, SOIC-14 |
| 文件页数： | 10/11页 |
| 文件大小： | 560K |
| 代理商： | ISL59442IBZ-T7 |
10
FN7452.2
September 21, 2005
PC Board Layout
The frequency response of this circuit depends greatly on
the care taken in designing the PC board. The following are
recommendations to achieve optimum high frequency
performance from your PC board.
The use of low inductance components such as chip
resistors and chip capacitors is strongly recommended.
Minimize signal trace lengths. Trace inductance and
capacitance can easily limit circuit performance. Avoid
sharp corners, use rounded corners when possible. Vias
in the signal lines add inductance at high frequency and
should be avoided. PCB traces greater than 1" begin to
exhibit transmission line characteristics with signal rise/fall
times of 1ns or less. High frequency performance may be
degraded for traces greater than one inch, unless strip
lines are used.
Match channel-channel analog I/O trace lengths and
layout symmetry. This will minimize propagation delay
mismatches.
Maximize use of AC de-coupled PCB layers. All signal I/O
lines should be routed over continuous ground planes (i.e.
no split planes or PCB gaps under these lines). Avoid vias
in the signal I/O lines.
Use proper value and location of termination resistors.
Termination resistors should be as close to the device as
possible.
When testing use good quality connectors and cables,
matching cable types and keeping cable lengths to a
minimum.
Minimum of 2 power supply de-coupling capacitors are
recommended (1000pF, 0.01μF) as close to the devices
as possible. Avoid vias between the cap and the device
because vias add unwanted inductance. Larger caps can
be farther away. When vias are required in a layout, they
should be routed as far away from the device as possible.
The NIC pins are placed on both sides of the input pins.
These pins are not internally connected to the die. It is
recommended these pins be tied to ground to minimize
crosstalk.
ISL59442
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL59444 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:1GHz, 4 x 1 Multiplexing Amplifier with Synchronous Controls |
| ISL59444IB | 功能描述:IC CROSSPOINT SW 1GHZ 4X1 16SOIC RoHS:否 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| ISL59444IB-T13 | 功能描述:IC CROSSPOINT SW 1GHZ 4X1 16SOIC RoHS:否 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| ISL59444IB-T7 | 功能描述:IC CROSSPOINT SW 1GHZ 4X1 16SOIC RoHS:否 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| ISL59444IBZ | 功能描述:IC CROSSPOINT SW 1GHZ 4X1 16SOIC RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
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