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| 型号： | ISL59446IRZ-EVAL |
| 厂商： | Intersil |
| 文件页数： | 4/13页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD FOR ISL59446 |
| 标准包装： | 1 |
| 系列： | * |
12
FN6261.2
June 5, 2012
Match Channel-Channel analog I/O trace lengths and
layout symmetry. This will minimize propagation delay
mismatches.
Maximize use of AC decoupled PCB layers. All signal I/O
lines should be routed over continuous ground planes (i.e.
no split planes or PCB gaps under these lines). Avoid vias
in the signal I/O lines.
Use proper value and location of termination resistors.
Termination resistors should be as close to the device as
possible.
When testing use good quality connectors and cables,
matching cable types and keeping cable lengths to a
minimum.
Minimum of 2 power supply decoupling capacitors are
recommended (1000pF, 0.01F) as close to the devices
as possible - avoid vias between the cap and the device
because vias add unwanted inductance. Larger caps can
be farther away. When vias are required in a layout, they
should be routed as far away from the device as possible.
The NIC pins are placed on both sides of the input pins.
These pins are not internally connected to the die. It is
recommended these pins be tied to ground to minimize
crosstalk.
The QFN Package Requires Additional PCB Layout
Rules for the Thermal Pad
The thermal pad is electrically connected to V- supply
through the high resistance IC substrate. Its primary function
is to provide heat sinking for the IC. However, because of the
connection to the V- supply through the substrate, the
thermal pad must be tied to the V- supply to prevent
unwanted current flow to the thermal pad. Do
not tie this pin
to GND as this could result in large back biased currents
flowing between GND and V-. The ISL59446 the package
with pad dimensions of D2 = 2.48mm and E2 = 3.4mm.
Maximum AC performance is achieved if the thermal pad is
attached to a dedicated decoupled layer in a multi-layered
PC board. In cases where a dedicated layer is not possible,
AC performance may be reduced at upper frequencies.
The thermal pad requirements are proportional to power
dissipation and ambient temperature. A dedicated layer
eliminates the need for individual thermal pad area. When
a dedicated layer is not possible a 1” x 1” pad area is
sufficient for the ISL59446 that is dissipating 0.5W in
+50°C ambient. Pad area requirements should be
evaluated on a case by case basis.
ISL59446
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL59446IRZ-T7 | 功能描述:IC AMP MUX 4:1 500MHZ 32-QFN RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| ISL59448 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:500MHz Triple 2:1 Gain-of-2, Multiplexing Amplifier |
| ISL59448EVAL1Z | 功能描述:EVAL BOARD 1 FOR ISL59448 RoHS:是 类别:编程器，开发系统 >> 评估演示板和套件 系列:* 标准包装:1 系列:PCI Express® (PCIe) 主要目的:接口，收发器，PCI Express 嵌入式:- 已用 IC / 零件:DS80PCI800 主要属性:- 次要属性:- 已供物品:板 |
| ISL59448IAZ | 功能描述:IC AMP TRIPLE MUX 500MHZ 24-QSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| ISL59448IAZ-T7 | 功能描述:IC AMP MUX 2:1 500MHZ 24-QSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 标准包装:1,000 系列:- 应用:驱动器 输出类型:差分 电路数:3 -3db带宽:350MHz 转换速率:1000 V/µs 电流 - 电源:14.5mA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):5 V ~ 12 V，±2.5 V ~ 6 V 安装类型:表面贴装 封装/外壳:20-VFQFN 裸露焊盘 供应商设备封装:20-QFN 裸露焊盘（4x4） 包装:带卷 (TR) |
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