参数资料
型号: ISL59450IQZ
厂商: Intersil
文件页数: 31/37页
文件大小: 0K
描述: IC SWITCH VID CRSSPNT 128-MQFP
标准包装: 66
系列: *
37
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FN7510.0
February 14, 2008
ISL59450
Metric Plastic Quad Flatpack Packages (MQFP)
Y
ALL AROUND
DROP IN HEAT SPREADER
4 STAND POINTS MAY BE EXPOSED
PIN 1 ID
D1
D
E
E1
18.
500
REF
12.500 REF
C0.600x0.350
(4X)
19.
870
±0.
100
20.
000
±0.
10
0
(E
1)
13.870 ±0.100
14.000 ±0.100
A
12° ALL
AROUND
(D1)
1
1 SECTION A-A
T
b
b1
T1
ccc
C
A2
A
A1
R0.13 MIN
R0.25 TYP
C
ddd
C
M
L1
0° MIN
0.200 MIN
α
T
GAUGE
PLANE
DETAIL Y
0.13~0.30
128
1
L
b
e
SEATING
PLANE
0.25 BASE
DO NOT TRY TO CONNECT ELECTRICALLY
MDP0055
14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT
SPREADER) 3.2mm FOOTPRINT
SYMBOL
DIMENSIONS
(MILLIMETERS)
REMARKS
A
Max 3.40
Overall height
A1
0.250~0.500
Standoff
A2
2.750 ±0.250
Package thickness
α
0°~7°
Foot angle
b
0.220 ±0.050
Lead width
b1
0.200 ±0.030
Lead base metal width
D
17.200 ±0.250
Lead tip to tip
D1
14.000 ±0.100
Package length
E
23.200 ±0.250
Lead tip to tip
E1
20.000 ±0.100
Package width
e
0.500 Base
Lead pitch
L
0.880 ±0.150
Foot length
L1
1.600 Ref.
Lead length
T
0.170 ±0.060
Frame thickness
T1
0.152 ±0.040
Frame base metal thickness
ccc
0.100
Foot coplanarity
ddd
0.100
Foot position
Rev. 2 2/07
NOTES:
1. General tolerance: Distance ±0.100, Angle +2.5°.
2.
Matte finish on package body surface except ejection and
pin 1 marking (Ra 0.8~2.0um).
3. All molded body sharp corner RADII unless otherwise specified
(Max RO.200).
4. Package/Leadframe misalignment (X, Y): Max. 0.127
5. Top/Bottom misalignment (X, Y): Max. 0.127
6. Drawing does not include plastic or metal protrusion or cutting
burr.
7.
Compliant to JEDEC MS-022.
1
2
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