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参数资料
| 型号： | ISL59530IKZ |
| 厂商： | Intersil |
| 文件页数： | 22/26页 |
| 文件大小： | 0K |
| 描述： | IC CROSSPOINT SW 16X16 356PBGA |
| 标准包装： | 40 |
| 功能： | 视频交叉点开关 |
| 电路： | 1 x 16:16 |
| 电流 - 电源： | 320mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 356-BGA |
| 供应商设备封装： | 356-PBGA（27x27） |
| 包装： | 托盘 |
| 产品目录页面： | 1247 (CN2011-ZH PDF) |
5
FN6220.8
April 13, 2011
Absolute Maximum Ratings (TA = +25°C)
Operating Conditions
Supply Voltage between VS and GND. . . . . . . . . . . . . . . . . . . . 6.0V
Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . . 40mA
Maximum power supply (VS) slew rate . . . . . . . . . . . . . . . . . . 1V/s
Thermal Information
Thermal Resistance
θJA (°C/W) θJC (°C/W)
72 Ld QFN (Note 3) . . . . . . . . . . . . . . .
27
N/A
356 Ld PBGA (Notes 4, 5) . . . . . . . . . .
29.7
14.6
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . see link below
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
ESD Classification
Human Body Model (analog input pins). . . . . . . . . . . . . . . . 3500V
Human Body Model (BGA, all pins except analog inputs) . 1500V
Human Body Model (QFN, all pins except analog inputs) . 1000V
Machine Model (analog input pins) . . . . . . . . . . . . . . . . . . . . 175V
Machine Model (BGA, all pins except analog inputs). . . . . . 100V
Machine Model (QFN, all pins except analog inputs). . . . . . 50V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
3.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379
4.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. For
θJC, the “case temp” location is taken at the package top center.
DC Electrical Specifications
VS = 5V, RL = 150Ω unless otherwise noted.
PARAMETER
DESCRIPTION
CONDITION
MIN
(Note 6)
TYP
MAX
(Note 6)
UNIT
VS
Power Supply Voltage
4.5
5.5
V
VSDO
Power Supply for SDO output pin
Establishes serial data output high level
1.2
5.5
V
AV
Gain
AV = 1
0.98
1
1.02
V/V
AV = 2
1.96
2
2.04
V/V
GM
Gain Matching (to average of all other
outputs)
AV = 1
-1.5
+1.5
%
AV = 2
-1.5
+1.5
%
VIN
Video Input Voltage Range
AV = 1
0
3.5
V
VOUT
Video Output Voltage Range
AV = 2
0.1
3.8
V
IB
Input Bias Current
Clamp function disabled (DC-coupled inputs)
-10
-5
1
A
Clamp function enabled, VIN = VREF + 0.5V
0.5
2
10
A
IREF
VREF Input Current
Clamp function enabled
-110
A
VOS
Output Offset Voltage
AV = 1
-20
8
35
mV
AV = 2
-70
-10
40
mV
IOUT
Output Current
Sourcing, RL = 10Ω to GND
60
108
mA
Sinking, RL = 10Ω to 2.5V
24
31
mA
PSRR
Power Supply Rejection Ratio
AV = 1 and AV = 2
50
70
dB
IS
Supply Current
Enabled, all outputs enabled, no load current
275
320
360
mA
Enabled, all outputs disabled, no load current
135
165
195
mA
Disabled
1.2
1.8
2.4
mA
AC Electrical Specifications
VS = 5V, RL = 150Ω unless otherwise noted.
PARAMETER
DESCRIPTION
CONDITION
MIN
(Note 6)
TYP
MAX
(Note 6)
UNIT
BW -3dB
3dB Bandwidth
VOUT = 200mVP-P, AV = 2
300
MHz
BW 0.1dB
0.1dB Bandwidth
VOUT = 200mVP-P, AV = 2
50
MHz
SR
Slew Rate
VOUT = 2VP-P, AV = 2
300
520
740
V/s
tS
Settling Time to 0.1%
VOUT = 2VP-P, AV = 2
12
ns
Glitch
Switching Glitch, Peak
AV = 1
40
mV
tover
Overlay Delay Time
From OVER rising edge to output transition
6
ns
ISL59530
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