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| 型号： | ISL5961EVAL1 |
| 厂商： | Intersil Corporation |
| 英文描述： | 14-Bit, +3.3V, 130/210MSPS, CommLinkTM High Speed D/A Converter |
| 中文描述： | 14位，3.3伏，130/210MSPS，CommLinkTM高速D / A转换 |
| 文件页数： | 13/13页 |
| 文件大小： | 899K |
| 代理商： | ISL5961EVAL1 |
3-13
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable.
However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
7585 Irvine Center Drive
Suite 100
Irvine, CA 92618
TEL: (949) 341-7000
FAX: (949) 341-7123
FAX: +41 21 7293684
Intersil Corporation
2401 Palm Bay Rd.
Palm Bay, FL 32905
TEL: (321) 724-7000
FAX: (321) 724-7946
EUROPE
Intersil Europe Sarl
Ave. C - F Ramuz 43
CH-1009 Pully
Switzerland
TEL: +41 21 7293637
ASIA
Intersil Corporation
Unit 1804 18/F Guangdong Water Building
83 Austin Road
TST, Kowloon Hong Kong
TEL: +852 2723 6339
FAX: +852 2730 1433
ISL5961
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA
E1
D
N
1
2
3
-B-
0.10(0.004)
C A
M
B S
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.378
0.386
9.60
9.80
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 0 6/98
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL5961EVAL2 | 功能描述:ISL5961 TSSOPEVALUATION PLATF RoHS:否 类别:编程器，开发系统 >> 评估板 - 数模转换器 (DAC) 系列:CommLink™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- DAC 的数量:4 位数:12 采样率（每秒）:- 数据接口:串行，SPI? 设置时间:3µs DAC 型:电流/电压 工作温度:-40°C ~ 85°C 已供物品:板 已用 IC / 零件:MAX5581 |
| ISL5961IA | 功能描述:IC DAC 14-BIT 130MSPS 28-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| ISL5961IAZ | 功能描述:CONV D/A 14-BIT 3.3V 28-TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 设置时间:1µs 位数:8 数据接口:串行 转换器数目:8 电压电源:双 ± 功率耗散（最大）:941mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC W 包装:带卷 (TR) 输出数目和类型:8 电压，单极 采样率（每秒）:* |
| ISL5961IB | 功能描述:IC DAC 14BIT 130MSPS 3.3V 28SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| ISL5961IBZ | 功能描述:CONV D/A 14-BIT 3.3V 28-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 设置时间:1µs 位数:8 数据接口:串行 转换器数目:8 电压电源:双 ± 功率耗散（最大）:941mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC W 包装:带卷 (TR) 输出数目和类型:8 电压，单极 采样率（每秒）:* |
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