参数资料
| 型号： | ISL6294IBZ |
| 厂商： | Intersil |
| 文件页数： | 3/9页 |
| 文件大小： | 0K |
| 描述： | IC CHRGR LI-ION SGL 8-SOIC |
| 标准包装： | 490 |
| 功能： | 充电管理 |
| 电池化学： | 锂离子（Li-Ion）、锂聚合物（Li-Pol） |
| 电源电压： | 4.5 V ~ 6.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
ISL6294
Electrical Specifications
Typical Values Are Tested at V IN = 5V and the Ambient Temperature at +25°C. All Maximum and Minimum
Values Are Guaranteed Under the Recommended Operating Supply Voltage Range and Ambient Temperature
Range, Unless Otherwise Noted. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
INTERNAL TEMPERATURE MONITORING
Charge Current Foldback Threshold
T FOLD
-
115
-
°C
LOGIC INPUT AND OUTPUTS
EN Pin Logic Input High
EN Pin Logic Input Low
EN Pin Internal Pull Down Resistance
1.3
-
100
-
-
200
-
0.5
400
V
V
k Ω
CHG Sink Current when LOW
CHG Leakage Current When HIGH
PPR Sink Current when LOW
PPR Leakage Current When HIGH
Pin Voltage = 1V
V CHG = 6.5V
Pin Voltage = 1V
V PPR = 6.5V
10
-
10
-
20
-
20
-
-
1
-
1
mA
μA
mA
μA
NOTES:
3. The 4.0V V BAT is selected so that the CHG output can be used as the indication for the offset comparator output indication. If the V BAT is lower
than the POR threshold, no output pin can be used for indication.
4. For junction temperature below +100°C.
5. The charge current can be affected by the thermal foldback function if the IC under the test setup cannot dissipate the heat.
Pin Descriptions
VIN - Power input. The absolute maximum input voltage is
28V. A 0.47μF or larger value X5R ceramic capacitor is
recommended to be placed very close to the input pin for
decoupling purpose. Additional capacitance may be required
to provide a stable input voltage.
PPR - Open-drain power presence indication. The open-
Where R IMIN is in k Ω . The programmable range covers 5%
(or 10mA, whichever is higher) to 50% of IREF. When
programmed to less than 5% or 10mA, the stability is not
guaranteed.
IREF - Charge-current program and monitoring pin. Connect
a resistor between this pin and the GND pin to set the
charge current limit determined by the Equation 2:
I REF = -----------------
drain MOSFET turns on when the input voltage is above the
POR threshold but below the OVP threshold and off
12089
R IREF
( mA )
(EQ. 2)
otherwise. This pin is capable to sink 10mA (minimum)
current to drive an LED. The maximum voltage rating for this
pin is 7V. This pin is independent on the EN-pin input.
CHG - Open-drain charge indication pin. This pin outputs a
logic LOW when a charge cycle starts and turns to HIGH
when the end-of-charge (EOC) condition is qualified. This
pin is capable to sink 10mA minimum current to drive an
LED. When the charger is disabled, the CHG outputs high
impedance.
EN - Enable input. This is a logic input pin to disable or
enable the charger. Drive to HIGH to disable the charger.
When this pin is driven to LOW or left floating, the charger is
enabled. This pin has an internal 200k Ω pull-down resistor.
GND - System ground.
IMIN - End-of-charge (EOC) current program pin. Connect a
resistor between this pin and the GND pin to set the EOC
current. The EOC current IMIN can be programmed by the
Equation 1:
Where R IREF is in k Ω . The IREF pin voltage also monitors
the actual charge current during the entire charge cycle,
including the trickle, constant-current, and constant-voltage
phases. When disabled, V IREF = 0V.
BAT - Charger output pin. Connect this pin to the battery. A
1μF or larger X5R ceramic capacitor is recommended for
decoupling and stability purposes. When the EN pin is pulled
to logic HIGH, the BAT output is disabled.
EPAD - Exposed pad. Connect as much as possible copper
to this pad either on the component layer or other layers
through thermal vias to enhance the thermal performance.
I MIN = ----------------
11000
R IMIN
( mA )
3
(EQ. 1)
FN9174.4
July 9, 2007
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