参数资料
型号: ISL6312CRZ-TK
厂商: Intersil
文件页数: 27/35页
文件大小: 0K
描述: IC CTRLR PWM 4PHASE BUCK 48-QFN
标准包装: 1,000
应用: 控制器,Intel VR10、VR11、AMD CPU
输入电压: 5 V ~ 12 V
输出数: 1
输出电压: 0.38 V ~ 1.6 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 48-VFQFN 裸露焊盘
供应商设备封装: 48-QFN(7x7)
包装: 带卷 (TR)
ISL6312
The total power dissipated by the upper MOSFET at full load
can now be approximated as the summation of the results
from Equations 25, 26, 27 and 28. Since the power
equations depend on MOSFET parameters, choosing the
correct MOSFETs can be an iterative process involving
PVCC
BOOT
C GD
D
repetitive solutions to the loss equations for different
MOSFETs and different switching frequencies.
R HI1
R LO1
UGATE
G
R G1
R GI1
C DS
Package Power Dissipation
C GS
Q1
When choosing MOSFETs it is important to consider the
amount of power being dissipated in the integrated drivers
located in the controller. Since there are a total of three
drivers in the controller package, the total power dissipated
by all three drivers must be less than the maximum
allowable power dissipation for the QFN package.
Calculating the power dissipation in the drivers for a desired
application is critical to ensure safe operation. Exceeding the
S
PHASE
FIGURE 16. TYPICAL UPPER-GATE DRIVE TURN-ON PATH
PVCC
D
maximum allowable power dissipation level will push the IC
beyond the maximum recommended operating junction
temperature of +125°C. The maximum allowable IC power
dissipation for the 7x7 QFN package is approximately 3.5W
at room temperature. See “Layout Considerations” on
page 32 for thermal transfer improvement suggestions.
R HI2
R LO2
LGATE
G
R G2
C GD
R GI2
C GS
C DS
Q2
When designing the ISL6312 into an application, it is
recommended that the following calculation is used to
ensure safe operation at the desired frequency for the
selected MOSFETs. The total gate drive power losses,
P Qg_TOT , due to the gate charge of MOSFETs and the
integrated driver ’s internal circuitry and their corresponding
average driver current can be estimated with Equations 29
and 30, respectively.
S
FIGURE 17. TYPICAL LOWER-GATE DRIVE TURN-ON PATH
The total gate drive power losses are dissipated among the
resistive components along the transition path and in the
bootstrap diode. The portion of the total power dissipated in
the controller itself is the power dissipated in the upper drive
P Qg_Q1 = --- ? Q G1 ? PVCC ? F SW ? N Q1 ? N PHASE
P Qg_TOT = P Qg_Q1 + P Qg_Q2 + I Q ? VCC
3
2
P Qg_Q2 = Q G2 ? PVCC ? F SW ? N Q2 ? N PHASE
(EQ. 29)
path resistance, P DR_UP , the lower drive path resistance,
P DR_UP , and in the boot strap diode, P BOOT . The rest of the
power will be dissipated by the external gate resistors (R G1
and R G2 ) and the internal gate resistors (R GI1 and R GI2 ) of
the MOSFETs. Figures 16 and 17 show the typical upper
and lower gate drives turn-on transition path. The total power
dissipation in the controller itself, P DR , can be roughly
estimated as:
I DR = ? --- ? Q G1 ? N
3
? 2
Q1
(EQ. 30)
?
+ Q G2 ? N Q2 ? ? N PHASE ? F SW + I Q
P DR = P DR_UP + P DR_LOW + P BOOT + ( I Q ? VCC )
3
P Qg_Q1
P BOOT = ---------------------
(EQ. 31)
P DR_UP = ? -------------------------------------- + ---------------------------------------- ? ? ---------------------
R HI1 + R EXT1 R LO1 + R EXT1 ?
?
P DR_LOW = ? ? ? ---------------------
? R HI2 R LO2 ? P Qg_Q2
? R HI2 + R EXT2
R LO2 + R EXT2 ?
2
In Equations 29 and 30, P Qg_Q1 is the total upper gate drive
power loss and P Qg_Q2 is the total lower gate drive power
loss; the gate charge (Q G1 and Q G2 ) is defined at the
particular gate to source drive voltage PVCC in the
corresponding MOSFET data sheet; I Q is the driver total
quiescent current with no load at both drive outputs; N Q1
and N Q2 are the number of upper and lower MOSFETs per
phase, respectively; N PHASE is the number of active
phases. The I Q* VCC product is the quiescent power of the
controller without capacitive load and is typically 75mW at
300kHz.
27
? R HI1 R LO1 ? P Qg_Q1
3
-------------------------------------- + ----------------------------------------
N N
R GI1 R GI2
R EXT1 = R G1 + ------------- R EXT2 = R G2 + -------------
Q1 Q2
FN9289.6
February 1, 2011
相关PDF资料
PDF描述
EMC25DREH-S734 CONN EDGECARD 50POS .100 EYELET
ESC20DRYN-S13 CONN EDGECARD 40POS .100 EXTEND
450USC390MEFCSN30X45 CAP ALUM 390UF 450V 20% SNAP-IN
400USC470MEFCSN35X40 CAP ALUM 470UF 400V 20% SNAP-IN
ESC20DRYH-S13 CONN EDGECARD 40POS .100 EXTEND
相关代理商/技术参数
参数描述
ISL6312CRZ-TR5312 功能描述:IC CTRLR PWM 4PHASE BUCK 48-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源,ICERA E400,E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA,WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR)
ISL6312CRZ-TR5338C 制造商:Rochester Electronics LLC 功能描述: 制造商:Intersil Corporation 功能描述:
ISL6312IRZ 功能描述:IC CTRLR PWM 4PHASE BUCK 48-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源,ICERA E400,E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA,WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR)
ISL6312IRZ-T 功能描述:IC CTRLR PWM 4PHASE BUCK 48-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源,ICERA E400,E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA,WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR)
ISL6313BCRZ 功能描述:IC CTRLR PWM BUCK 2PHASE 36-TQFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 标准包装:43 系列:- 应用:控制器,Intel VR11 输入电压:5 V ~ 12 V 输出数:1 输出电压:0.5 V ~ 1.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-VFQFN 裸露焊盘 供应商设备封装:48-QFN(7x7) 包装:管件